Radio frequency printed circuit board (PCB) production process
A PCB board and manufacturing process technology, applied in the field of RF PCB board manufacturing process, can solve the problems of attenuation, reduce product service life, signal loss, etc., and achieve the effect of increasing heat dissipation area, prolonging product life, and accurate size
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[0018] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, and to analyze the advantages and spirit of the present invention, a further understanding of the present invention can be obtained through the following detailed description of the present invention in conjunction with the accompanying drawings and specific embodiments.
[0019] see figure 1 and figure 2 , the radio frequency PCB board manufacturing process of the present invention, it comprises the following steps:
[0020] Step 1: Cutting the material, selecting the appropriate high-frequency core board 10, copper plate 30 and high-frequency prepreg 20, wherein the high-frequency core board 10 and the high-frequency prepreg 20 are thin plates, and the high-frequency core board 10 and high-frequency prepreg 20 The thicknesses are 0.05-0.2 mm, and the thickness of the copper plate 30 is 0.7-1.1 mm. In this embodiment, the thickness of the...
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