Producing method for simple SMT (surface mount technology) otter board

A manufacturing method and stencil technology, applied in printing, printing plate preparation, etc., can solve the problems of long stencil production cycle, large space occupied by stencil, and high manufacturing cost, so as to reduce management cost and maintenance cost, save materials, low production cost

Inactive Publication Date: 2013-05-01
NETRON SOFT-TECH ZHUHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the manufacturing cost is high, and the cost of processing a steel mesh is about 300 yuan; the steel mesh takes up a lot of space, and the size of the general steel mesh is 450x550x40mm. To make five stencils, in one month, the minimum storage space occupied by the stencils is 1.485m 3 , a year is 542m 3 , which will greatly restrict the space utilization of the factory
And if the stencil is recycled to the recycler, the recycling price is 3 yuan, which is 100 times different from the cost, which is equivalent to increasing the investment in production
In addition, the production cycle of the stencil is relatively long, and it takes 1 day

Method used

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  • Producing method for simple SMT (surface mount technology) otter board
  • Producing method for simple SMT (surface mount technology) otter board
  • Producing method for simple SMT (surface mount technology) otter board

Examples

Experimental program
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Effect test

Embodiment Construction

[0026] as attached figure 1 , attached figure 2 and attached image 3 As shown, the SMT simple stencil manufacturing method includes the following steps:

[0027] Step S1, cutting a plate made of FR4 material to replace the steel mesh, usually with a thickness of 0.1mm.

[0028] In step S2, the FR4 plate 1 is drilled with a laser machine according to the place where the FPC or PCB board is to be SMT, for adding tin.

[0029] Step S3, find a complete stencil with a tension of 15-25N / cm2 from the stencils scrapped after the printing process, the stencil is composed of a square frame 2 and a screen installed in the middle of the frame 2 3 composition.

[0030] Step S4, use the adhesive 4 to evenly paste the FR4 plate 1 to the center of the screen along the edge of the FR4 plate 1, and ensure that the surroundings of the FR4 plate 1 are parallel to the frame of the screen to avoid subsequent printing. , resulting in an angular shift.

[0031] Step S5, use transparent glue 5...

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PUM

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Abstract

The invention discloses a producing method for a simple SMT otter board, which includes the following steps: a, cropping an FR4 board; b, tapping the FR4 board through a laser; c, preparing an otter board; e, edge-sealing an adhesive position of the FR4 board and the otter board; f, cutting out a screen mesh overlapped with the FR4 board at the back of the otter board; g, edge-sealing the edges of the cut-out screen mesh and the FR4 board; and h, detecting the screen mesh tension of the otter board to finish the otter board production. When the producing method is used for processing FPCs (flexible printed circuits) or PCBs (printed circuit boards), the production time and cost for otter boards can be reduced greatly, and the material storage space can be reduced for factories, thereby reducing the administrative and maintenance costs of enterprises.

Description

technical field [0001] The invention relates to a method for making a simple SMT screen. Background technique [0002] With the rapid development of electronic products, the SMT industry has also sprung up like mushrooms. Under the condition of relatively stable technical level, how to achieve faster efficiency and lower cost is an important guarantee for enterprises to improve their competitiveness. The production process of SMT generally includes the following steps: 1. Making a stencil for printing solder paste; 2. Printing solder paste on FPC or PCB with a stencil; 3. Mounting components; 4. Curing by reflow soldering; 5. Product testing. [0003] At present, some technicians have improved steps 2 to 5 of the process, thereby improving production efficiency. The improved steps are as follows: 2. Print solder paste on FPC or PCB with stencil: manual by single piece Printing is changed to use full-automatic visual printing machine for full-board printing; 3. Mounting com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41C1/14
Inventor 刘惠民彭勇强
Owner NETRON SOFT-TECH ZHUHAI CO LTD
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