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Novel manufacturing method of hot wire micro-sensor with flexible wall surface

A technology of micro-sensors and flexible walls, applied in the field of micro-electromechanical systems, can solve the problems of affecting sensor performance, easy to break, affecting the size parameters and measurement performance of sensitive components, and achieving the effect of easy guarantee of graphic accuracy

Active Publication Date: 2013-05-08
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The disadvantage of this manufacturing method is that after forming the cavity structure, wet etching removes the mask metal layer and at the same time it will corrode the already formed sensitive element, which will affect the dimensional parameters and measurement performance of the sensitive element, so that the hot wire sensitive unit cannot reach the design. Requirements, easy to break, reduce its service life, thereby affecting the performance of the sensor

Method used

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  • Novel manufacturing method of hot wire micro-sensor with flexible wall surface
  • Novel manufacturing method of hot wire micro-sensor with flexible wall surface
  • Novel manufacturing method of hot wire micro-sensor with flexible wall surface

Examples

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Embodiment 1

[0025] This embodiment proposes a method of etching on the back of the flexible hot wire microsensor, mainly that the patterning process of the sensitive element is a wet etching process, which specifically includes the following steps:

[0026] Step 1: Cut the copper foil with a thickness of 100 microns into a disc with a diameter of 80mm, and use a polishing machine to polish the surface, and clean the copper foil after polishing;

[0027] Step 2: Spin-coat PDMS with a thickness of 5 microns on the surface of the cleaned copper foil, wherein the ratio of PDMS glue and curing agent is 10:1; the rotation speed is 2500RPM;

[0028] Step 3: Lay a polyimide film with a thickness of 125 microns on the surface of copper foil spin-coated with PDMS, and stick it at a temperature of 70°C and a pressure of 130Pa;

[0029] Step 4: Put the polyimide with copper foil as the carrier into the sputtering chamber, deposit 0.3 μm nickel and 2 μm copper films respectively, and use a solution wi...

Embodiment 2

[0035] This embodiment proposes a method of etching on the back of the flexible hot wire microsensor, mainly the patterning method of the sensitive element is a stripping process, which specifically includes the following steps:

[0036] Step 1: Cut the aluminum foil with a thickness of 100 microns into a disc with a diameter of 80mm, and polish the surface with a polishing machine, and clean the aluminum foil after polishing;

[0037] Step 2: Spin-coat PDMS with a thickness of 5 microns on the surface of the cleaned aluminum foil, wherein the ratio of PDMS glue and curing agent is 10:1; the rotation speed is 2500RPM;

[0038] Step 3: Lay a polyimide film with a thickness of 125 microns on the surface of copper foil spin-coated with PDMS, and stick it at a temperature of 70°C and a pressure of 130Pa;

[0039] Step 4: Spin-coat the photoresist on polyimide with aluminum foil as the carrier, expose and develop, put the patterned photoresist into the sputtering chamber, deposit 0...

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Abstract

The invention discloses a novel manufacturing method of a hot wire micro-sensor with a flexible wall surface, and belongs to the field of micro electro mechanical systems (MEMS). The novel manufacturing method disclosed by the invention comprises the following steps of: fixing a flexible substrate in the processing by adopting a flexible metal carrier; graphing devices and conducting wires on the front surface of the flexible substrate through using a standard lithography process; depositing Parylene as a protecting and strengthening layer on the front surface of the flexible substrate; sticking a photoreceptive blue film on the back of the flexible metal carrier; graphing the flexible metal carrier by adopting mask exposure and wet etching; forming a hard mask for etching the flexible substrate; locally etching the flexible substrate through reactive ion etching (RIE); and separating the sensor from the flexible metal carrier by adopting a high-temperature heating method after the etching. The novel manufacturing method disclosed by the invention is capable of effectively protecting a sensitive unit of the hot wire micro-sensor with the flexible wall surface and improving performances of the sensor; and furthermore, the service life is also greatly increased.

Description

Technical field: [0001] The invention relates to a novel manufacturing method of a flexible wall heating wire microsensor, which belongs to the field of micro-electromechanical systems (MEMS). Background technique: [0002] The hot wire sensor is one of the important measurement devices in the field of flow field information testing. As an efficient and reliable measuring device, it is often used to detect the flow state of the flow field. Due to the advantages of fast dynamic response, high sensitivity and high signal-to-noise ratio, MEMS-based wall hot-wire microsensors have broad application prospects in the measurement of fluid wall shear stress and unsteady flow. The wall hot-wire microsensor using polyimide flexible substrate not only has all the advantages of conventional wall hot-wire microsensors, but also can be applied to the measurement of various complex surfaces such as wings, fuselages, and turbine blades. Aerodynamics provide a reliable means of support. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 马炳和朱鹏飞马旭轮邓进军
Owner NORTHWESTERN POLYTECHNICAL UNIV