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Positive photosensitive resin composition, cured film, method for forming the same, liquid crystal display device, and organic electroluminescence display device

A technology of photosensitive resin and composition, which is applied in the direction of photosensitive materials used in optomechanical equipment, optomechanical equipment, optics, etc., and can solve the problem of low tolerance, low dry etching tolerance, liquid crystal display device display, etc. Excellent dry etching resistance and high tolerance

Inactive Publication Date: 2018-05-18
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the photosensitive resin composition proposed in Japanese Patent Application Laid-Open No. 2009-258722 and International Publication No. 2009 / 136647 is not suitable for a resist stripping solution (mainly monoethanolamine) used after forming an interlayer insulating film. (MEA)), or in particular, the resistance to NMP (N-methylpyrrolidone) as a solvent is not high, and the resistance to dry etching is not high, so it is easy to cause display defects in liquid crystal display devices, and improvement is required.

Method used

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  • Positive photosensitive resin composition, cured film, method for forming the same, liquid crystal display device, and organic electroluminescence display device
  • Positive photosensitive resin composition, cured film, method for forming the same, liquid crystal display device, and organic electroluminescence display device
  • Positive photosensitive resin composition, cured film, method for forming the same, liquid crystal display device, and organic electroluminescence display device

Examples

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preparation example Construction

[0515] [Method for preparing photosensitive resin composition]

[0516] The essential components of the specific resin and the acid generator are optionally mixed with a solvent in a predetermined ratio by an arbitrary method, followed by stirring and dissolving to prepare a photosensitive resin composition. For example, it is also possible to prepare a photosensitive resin composition by mixing a specific resin or an acid generator in a solvent in advance to prepare a solution, and then mixing them at a predetermined ratio. The solution of the photosensitive resin composition prepared as above can also be used after filtering using the filter etc. whose pore diameter is 0.1 micrometer.

[0517]

[0518] A desired dry coating film can be formed by coating a photosensitive resin composition on a predetermined substrate and removing the solvent by reducing pressure and / or heating (prebaking). As the substrate, for example, in the manufacture of a liquid crystal display device...

example

[0559] Next, the present invention will be described more specifically by way of examples. However, the present invention is not limited by these examples. In addition, "part" and "%" are based on weight unless otherwise indicated.

Synthetic example 1

[0561]150 parts by weight of diethylene glycol ethyl methyl ether was added to a flask equipped with a cooling tube and a stirrer, and the temperature was raised to 90° C. under a nitrogen atmosphere. 41.3 parts by weight of 1-ethoxyethyl methacrylate, 31.0 parts by weight of 3-ethyl-3-oxetanylmethyl methacrylate, 5.6 parts by weight of methacrylic acid, 2 - 17.0 parts by weight of ethylhexyl ester, and 10.0 parts by weight of dimethyl-2,2'-azobis(2-methylpropionate) (manufactured by Wako Pure Chemical Industries) as a polymerization initiator were dissolved for 2 Add dropwise to the solution for hours. After completion of the dropwise addition, the mixture was stirred for 2 hours. Further, 2.5 parts by weight of dimethyl-2,2'-azobis(2-methylpropionate) was added to this solution, and the reaction was completed after stirring for 2 hours. Copolymer A-1 was thus obtained. The weight average molecular weight was 11,000.

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Abstract

The invention provides a positive photosensitive resin composition, a method for forming a cured film, a cured film, a liquid crystal display device, and an organic electroluminescence display device. Or NMP has high tolerance, good adhesion to transparent electrode films or metals, excellent dry etching resistance, and a cured film that is less likely to cause poor display even in a display device. A positive-type photosensitive resin composition comprising: (ingredient A) a polymer component containing at least one of polymers satisfying (1) and (2), (1) having (a1) containing an acid group decomposable by an acid group-protected group constitutional units, and (a2) a polymer containing a crosslinkable group constitutional unit, (2) a polymer having (a1) a constitutional unit containing an acid group protected by an acid-decomposable group, and It has (a2) a polymer having a structural unit containing a crosslinkable group; (component C) a photoacid generator; and (component D) a solvent.

Description

technical field [0001] The invention relates to a positive photosensitive resin composition, a method for forming a cured film, a cured film, a liquid crystal display device and an organic electroluminescence (EL) display device. More specifically, the present invention relates to a positive-type photosensitive resin suitable for forming planarizing films, protective films, or interlayer insulating films of electronic components such as liquid crystal display devices, organic EL display devices, integrated circuit devices, and solid-state imaging devices. Composition, and method for forming a cured film using the same. Background technique [0002] In electronic components such as thin film transistor (hereinafter referred to as "TFT (Thin Film Transistor)") type liquid crystal display elements, magnetic head elements, integrated circuit elements, and solid-state imaging elements, in order to insulate wirings arranged in layers Instead, an interlayer insulating film is prov...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039G03F7/00G02F1/1333H01L27/32H01L51/54
CPCG02F1/13G02F1/1303G03F7/004G03F7/0043G03F7/0045G03F7/039G03F7/0392H10K50/11
Inventor 米泽裕之川岛敬史山﨑健太疋田政宪
Owner FUJIFILM CORP