Positive photosensitive resin composition, cured film, method for forming the same, liquid crystal display device, and organic electroluminescence display device
A technology of photosensitive resin and composition, which is applied in the direction of photosensitive materials used in optomechanical equipment, optomechanical equipment, optics, etc., and can solve the problem of low tolerance, low dry etching tolerance, liquid crystal display device display, etc. Excellent dry etching resistance and high tolerance
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[0515] [Method for preparing photosensitive resin composition]
[0516] The essential components of the specific resin and the acid generator are optionally mixed with a solvent in a predetermined ratio by an arbitrary method, followed by stirring and dissolving to prepare a photosensitive resin composition. For example, it is also possible to prepare a photosensitive resin composition by mixing a specific resin or an acid generator in a solvent in advance to prepare a solution, and then mixing them at a predetermined ratio. The solution of the photosensitive resin composition prepared as above can also be used after filtering using the filter etc. whose pore diameter is 0.1 micrometer.
[0517]
[0518] A desired dry coating film can be formed by coating a photosensitive resin composition on a predetermined substrate and removing the solvent by reducing pressure and / or heating (prebaking). As the substrate, for example, in the manufacture of a liquid crystal display device...
example
[0559] Next, the present invention will be described more specifically by way of examples. However, the present invention is not limited by these examples. In addition, "part" and "%" are based on weight unless otherwise indicated.
Synthetic example 1
[0561]150 parts by weight of diethylene glycol ethyl methyl ether was added to a flask equipped with a cooling tube and a stirrer, and the temperature was raised to 90° C. under a nitrogen atmosphere. 41.3 parts by weight of 1-ethoxyethyl methacrylate, 31.0 parts by weight of 3-ethyl-3-oxetanylmethyl methacrylate, 5.6 parts by weight of methacrylic acid, 2 - 17.0 parts by weight of ethylhexyl ester, and 10.0 parts by weight of dimethyl-2,2'-azobis(2-methylpropionate) (manufactured by Wako Pure Chemical Industries) as a polymerization initiator were dissolved for 2 Add dropwise to the solution for hours. After completion of the dropwise addition, the mixture was stirred for 2 hours. Further, 2.5 parts by weight of dimethyl-2,2'-azobis(2-methylpropionate) was added to this solution, and the reaction was completed after stirring for 2 hours. Copolymer A-1 was thus obtained. The weight average molecular weight was 11,000.
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