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Magnetron sputtering system with single-heating self-rotation disc

A technology of magnetron sputtering system and turntable, which is applied in the field of magnetron sputtering system to achieve the effects of easy maintenance and replacement, high vacuum degree and convenient control

Inactive Publication Date: 2013-05-15
SHENYANG SCI INSTR RES CENT CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing magnetron sputtering equipment can only achieve vertical sputtering of single and multiple targets or co-sputtering of multiple targets

Method used

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  • Magnetron sputtering system with single-heating self-rotation disc
  • Magnetron sputtering system with single-heating self-rotation disc

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Experimental program
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Embodiment Construction

[0013] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0014] The present invention has a single-chamber structure, and can perform oblique target co-sputtering composite films in the magnetron chamber 1, such as figure 1 , figure 2 As shown, the magnetic control room 1 is a cylindrical vertical structure, fixed on the machine frame 7 through the lower flange 15; flange interfaces of various specifications are welded on the circumferential surface of the magnetic control room 1, including observation windows, side drawers Angle valve interface, inlet valve interface, electrode lead interface, gauge interface, magnetron sputtering target interface, main pump molecular pump interface, substrate baffle interface, reserved manipulator interface for auxiliary handover, pretreatment chamber interface and Some spare flange interfaces are convenient for function expansion; the magnetic control room 1 is connected to th...

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Abstract

The invention relates to coating equipment, and particularly relates to a magnetron sputtering system with a single-heating self-rotation disc. The magnetron sputtering system comprises a magnetron chamber, a single-heating self-rotation disc, a first motor, a manual substrate baffle component, magnetron targets, a gantry and a vacuum-pumping system, wherein the magnetron chamber is mounted on the gantry and is connected with the vacuum-pumping system positioned in the gantry; the multiple magnetron targets mounted on a lower flange of the magnetron chamber are evenly distributed in the magnetron chamber; the single-heating self-rotation disc is mounted on an upper cover of the magnetron chamber in a rotating manner; one end of the single-heating self-rotation disc is provided with a substrate, inserted into the magnetron chamber and positioned above each magnetron target, and the other end is positioned above the upper cover; the first motor is mounted on the upper cover and drives the single-heating self-rotation disc to rotate; and the manual substrate baffle component mounted on the upper cover is arranged below the substrate arranged on the single-heating self-rotation disc. The magnetron sputtering system provided by the invention is simple in structure, convenient to control and high in vacuum degree. According to the invention, the upper cover can be lifted upwards by an electric lift mechanism, thereby facilitating maintenance and replacement.

Description

technical field [0001] The invention relates to coating equipment, in particular to a magnetron sputtering system with a single heating self-rotating disk. Background technique [0002] At present, devices using the principle of magnetron sputtering (high-speed and low-temperature sputtering) can prepare nanoscale single-layer and multi-layer functions such as various hard films, metal films, semiconductor films, dielectric films, ferromagnetic films, and magnetic films. membrane. Its characteristics are: all kinds of materials that can be prepared into targets can be used as thin film materials, including various metals, semiconductors, ferromagnetic materials, and insulating oxides, ceramics, polymers, etc., especially suitable for high melting point and low Vapor pressure material deposition coating. Co-sputtering with multi-component targets under appropriate conditions can deposit mixtures and compound films of required components; adding oxygen, nitrogen or other act...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 冯彬郭东民佟辉周景玉刘丽华张雪戚晖
Owner SHENYANG SCI INSTR RES CENT CHINESE ACAD OF SCI