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Electromagnetic wave shielding material for fpc

A technology for shielding materials and electromagnetic waves, applied in magnetic field/electric field shielding, conductive materials dispersed in non-conductive inorganic materials, electrical components, etc., can solve problems such as interlayer peeling, and achieve the effect of suppressing thickness and rich flexibility

Active Publication Date: 2015-09-16
FUJIMORI KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the metal foil layer or the base film layer serves as a gas barrier layer, a peeling force acts between the gas barrier layers due to expansion such as degassing, and there is a problem of interlayer peeling.

Method used

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  • Electromagnetic wave shielding material for fpc
  • Electromagnetic wave shielding material for fpc
  • Electromagnetic wave shielding material for fpc

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0118] A polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., product number: E5100) having a thickness of 50 μm was used as the support film 6 . On one side of the support film 6, the water vapor transmission rate when the thickness is 33 μm is 180 g / m 2 - The coating liquid of Tian's solvent-soluble polyimide was cast-coated so that the thickness after drying became 4 micrometers, it was dried, and the base material 1 which consists of a dielectric thin resin film was laminated|stacked. On the formed base material 1, the paint for forming the adhesive bond layer 2 is applied so that the thickness after drying is 0.3 μm, and the adhesive bond layer 2 is laminated. Carbon black, the black pigment of the material, is mixed with a polyester resin composition with a heat resistance temperature of 260~280°C. On the adhesive layer 2, as a conductive filler, a conductive paste prepared by mixing silver particles with a primary average particle diameter of about ...

Embodiment 2）

[0120] Same as Example 1, except that the coating solution of solvent-soluble polyimide was cast-coated so that the thickness after drying became 6 μm, dried, and the base material 1 composed of a dielectric thin resin film was laminated. Similarly, the electromagnetic wave shielding material of Example 2 was obtained.

Embodiment 3）

[0122] Same as Example 1, except that the coating solution of solvent-soluble polyimide was cast-coated so that the thickness after drying became 8 μm, dried, and the substrate 1 composed of a dielectric thin resin film was laminated. Similarly, the electromagnetic wave shielding material of Example 3 was obtained.

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Abstract

The invention provides an electromagnetic wave shielding material (10) for FPC, wherein the peeling phenomenon due to water vapor generated during the intense heating process is avoided. Meanwhile, the electromagnetic wave shielding material is in the form of a soft film and is excellent in electromagnetic wave shielding performance and bending property even after being subjected to severe bending treatment repeatedly. According to the technical scheme of the invention, one surface of a supporting film (6) is orderly laminated with a substrate (1) composed of a resin film coated with a dielectric medium, a film adhesive layer (2), a conductive paste layer (3) and a conductive adhesive layer (4). The water vapor transmission rate of the substrate is larger than 500g / m2 per day.

Description

technical field [0001] The present invention relates to an electromagnetic wave shielding material for FPC, which covers a flexible printed circuit board (Flexible Printed Circuits, hereinafter referred to as FPC) repeatedly subjected to bending action, and is used for shielding electromagnetic waves. Background technique [0002] In portable electronic devices such as mobile phones, electronic components are integrated on printed circuit boards in order to reduce the external dimensions of the housing and control them for easy carrying and transportation. In addition, in order to reduce the external dimensions of the box, by dividing the printed circuit board into multiple parts, and using a flexible FPC for the connection wiring between the divided printed circuit boards, the printed circuit board can be folded, or the printed circuit board can be folded. It slides. [0003] In addition, in recent years, important electronic components and FPCs are covered with electromag...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00H04M1/02
CPCY02A30/00B32B7/12B32B27/281B32B27/285H01B1/22H01B5/14H05K9/0081
Inventor 野村直宏藤井早苗樱木乔规稻叶佑子后藤信弘
Owner FUJIMORI KOGYO CO LTD