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Novel ultrasonic wave sensor

An ultrasonic and sensor technology, applied in the field of sensors, can solve problems such as low sensitivity, large aftershocks, and small amplitudes

Inactive Publication Date: 2013-05-22
江苏波速传感器有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] Most of the piezoelectric ultrasonic sensors currently on the market are mainly piezoelectric single-chip ultrasonic sensors. Although this type of sensor is simple to manufacture, the amplitude of the single-chip sensing the sound wave is small, so the sensitivity is low; at the same time, in order to meet the capacitance and Frequency requirements, the single chip is small, thin, and light in weight, so the aftershock is relatively large

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Embodiment Construction

[0017] Such as figure 1 As shown, the novel ultrasonic sensor of the present invention includes a hollow metal casing 1, one end of the metal casing 1 is covered with a matching layer 2, and a parallel piezoelectric bimorph 3 is glued inside the matching layer 2. The matching layer 2 and the piezoelectric sheet are directly bonded with glue, and the size, density, thermal expansion coefficient, elastic modulus, and Poisson's ratio of the matching layer must be matched with the piezoelectric sheet to determine the resonance frequency of the ultrasonic sensor.

[0018] Such as figure 2 with image 3 As shown, the parallel piezoelectric bimorph 3 is to bond two opposite electrode surfaces of two piezoelectric wafers to both sides of a metal substrate, that is, the negative electrode surface of the first piezoelectric ceramic sheet 202 and the metal substrate 201 The upper surface is bonded; the positive side of the second piezoelectric ceramic sheet 203 is bonded to the lower surfa...

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Abstract

The invention relates to a sensor, in particular to a novel ultrasonic wave sensor which comprises a hollow metal outer case. One end of the metal outer case is covered by a matching layer in a sealing mode. The inner side of the matching layer is provided with piezoelectric bimorphs in parallel in a pasted mode. The piezoelectric bimorphs in parallel are formed in the mode that the two opposite electrode faces of the two piezoelectric bimorphs are respectively pasted on two faces of a metal substrate, the other two electrode faces of the two piezoelectric bimorphs are electrically connected, and a common connecting end of the two piezoelectric bimorphs and the metal substrate are respectively connected with a connecting terminal. The novel ultrasonic wave sensor is simple in structure, high in sensitivity, and small in aftershock.

Description

Technical field [0001] The invention relates to a sensor, particularly an ultrasonic sensor. Background technique [0002] Ultrasonic sensors are sensors developed using the characteristics of ultrasound. Ultrasound is a mechanical wave with a higher vibration frequency than sound waves. It is generated by the vibration of the transducer wafer under the excitation of voltage. It has high frequency, short wavelength, small diffraction phenomenon, especially good directivity, which can be directed into rays. Dissemination and other characteristics. When the ultrasonic wave hits the impurity or the interface, it will produce a significant reflection to form a reflected echo, and it can produce a Doppler effect when it hits a moving object. Therefore, ultrasonic testing is widely used in industry, national defense, biomedicine, etc. To use ultrasound as a detection method, ultrasound must be generated and received. The device that accomplishes this function is an ultrasonic senso...

Claims

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Application Information

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IPC IPC(8): B06B1/06
Inventor 余方云李红元邹东平龙阳张尧倪雪晴
Owner 江苏波速传感器有限公司
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