Preparation method of high-tenacity and high-inflaming-resistance modified phenolic resin

Abstract

The invention provides a preparation method of high-tenacity and high-inflaming-resistance modified phenolic resin. The preparation method includes the steps: preparing a mixture I of paraformaldehyde (in powder form) and liquid formaldehyde, and conducting polymerization reaction on polyvinylpyrrolidone, fatty alcohol, propylene glycol polyoxyethylene polypropylene oxide ether, tung oil and isocyanic acid ester to obtain a mixture II; adding phenol and a base catalyst in a reactor, wherein the mole rate of the phenol and the base catalyst is 2.5 : 0.003-0.01; stirring and heating to 65-75 DEG C, and adding the mixture I, wherein the mole rate of the phenol, the base catalyst and the mixture I is 2.5 : 0.03-0.01 : 1.5-3.0; reducing temperature to 40-50 DEG C; and adding aluminum hydroxide powder and pentaerythritol powder, wherein the aluminum hydroxide powder and the pentaerythritol powder have inflaming resistance and fire resistance functions, and the adding quantity is 5-9 % of the mass of the high-tenacity modified phenolic resin. The phenolic resin prepared by the preparation method has the advantages of good tenacity and high inflaming resistance, and in the production process, dehydration is not needed and discharge does not exist.

Description

technical field [0001] The invention relates to a method for preparing a modified phenolic resin with high toughness and high flame retardancy, and belongs to the technical field of preparation methods of phenolic resins. Background technique [0002] The existing technology for toughening phenolic foam boards is: the use of liquid formaldehyde to produce phenolic resin must adopt a dehydration process. Although the cost is low, it produces a large amount of wastewater containing phenol and aldehyde, which increases the cost of high post-treatment wastewater. The discharge will cause damage to the environment and groundwater resources. Although the use of paraformaldehyde (solid) to produce phenolic resin solves the problem of wastewater discharge, the cost increases by 10%-20%, and a large amount of water needs to be added simultaneously, resulting in waste of water resources. Additives with toughening effects are added during the production process, but phenolic resin is ...

AI Technical Summary

Problems solved by technology

[0002] The existing technology for toughening phenolic foam boards is: the use of liquid formaldehyde to produce phenolic resin must adopt a dehydration process. Although the cost is low, it produces a large amount of wastewater containing phenol and aldehyde, which increases the cost of high post-treatment wastewater. Discharge causes damage to the environment and groundwater resources

Although the use of paraformaldehyde (solid) to produce phenolic resin solves the problem of wastewater discharge, the cost increases by 10%-20%, and a large amount of water needs to be added at the same time, resulting in waste of water resources

In the production process, additives with toughening effect are added, but phenolic resin is prone to smoldering phenomenon after being processed into foam boards, which poses certain safety hazards to transportation, storage and users