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Coating composition and uses thereof

A composition and coating technology, applied in conductive coatings, coatings, conductive adhesives, etc., can solve problems such as misalignment, peeling coordination, and wiring drop-off

Active Publication Date: 2013-06-05
浙江奕成科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In recent years, as the size of the circuit wiring patterns or electrodes connected by the anisotropic conductive film has become smaller and smaller, the connection of higher temperature and longer connection time used in circuit connection materials using conventional epoxy resin adhesives Conditions, there will be problems such as wiring drop, peeling or coordination mismatch

Method used

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  • Coating composition and uses thereof
  • Coating composition and uses thereof
  • Coating composition and uses thereof

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0058] According to a preferred embodiment of the present invention, the polythiol compound is:

[0059]

[0060]

[0061] The content of the polythiol compound is about 0.5% to about 15% of the total weight, preferably about 2% to about 10%, based on the total weight of the solid content of the coating composition.

[0062] The initiator used in the coating composition of the present invention is not particularly limited, and it will quickly generate free radicals (free radicals) after providing thermal energy or energy rays (such as UV light), and initiate polymerization through the transmission of free radicals. The initiator of the invention is a thermal initiator, a photoinitiator or a mixture thereof, and a preferred initiator is an organic peroxide having a half-life temperature of 5 hours to 15 hours at 40°C to 100°C. Within this range, the coating composition of the present invention can be stored without any difficulty at room temperature and can be cured rapid...

Embodiment 1 to 7 and comparative example 1 to 3

[0087] The anisotropic conductive film materials of Examples 1 to 7 and Comparative Examples 1 to 3 were prepared according to the methods described below, and their compositions are listed in Table 1.

[0088] The thermoplastic resin, radical polymerizable compound, thiol compound and conductive particles are uniformly mixed with the solvent according to the solid content weight (%) listed in Table 1, and diluted with the solvent until the solid content is 50% of the weight of the coating composition, that is A coating composition is obtained; the above-mentioned solvent is prepared in a weight ratio of toluene:ethyl acetate=1:1.

[0089] Table 1

[0090]

[0091]

[0092] Thiol compound PEMP:

[0093] Thiol compound PE1:

[0094] Thiol compound EGMP-4:

[0095] Thiol compound DPMP:

[0096] Thiol compound T MMP:

[0097] Thiol compound MPM:

[0098] Thiol compound B MPA:

[0099] Acrylate monomer ETERMER231: Trimethylolpropane triacrylate

[0100]...

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PUM

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Abstract

The invention relates to coating composition which comprises: a) conducting particles; b) free radical polymerization type compounds; c) thermoplastic resin; d) mercaptan compounds, and e) an initiator. The coating composition can be used for forming an anisotropy conducting film and applied to a circuit connecting structure of an electronic product. The coating composition has good electrical conductivity, adhesive property and durability.

Description

technical field [0001] The present invention relates to a coating composition. More specifically, the present invention relates to an anisotropic conductive film (Anisotropic Conductive Film) comprising these coating compositions suitable for circuit connections of electronic products. Background technique [0002] The anisotropic conductive film is a material in which conductive particles are dispersed in an insulating adhesive, and its main components include a resin adhesive and conductive particles. In addition to the moisture-proof function, the resin adhesive also provides heat-resistant and insulating functions. The anisotropic conductive film can be used as the connection between the liquid crystal display and the semiconductor chip in the way of chip-on-glass bonding technology (Chip On Glass, COG) or the connection between the tape carrier package (TCP), flexible printed circuit Board (Flexible Printed Circuit, FPC soft board) and the connecting member of the con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/02C09D4/00C09D4/06C09D5/24C09D7/12C09J7/02C09J9/02
Inventor 汪乙嘉黄暐婷苏家怡庄闵超丁佳庆
Owner 浙江奕成科技有限公司