Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate bonding system and substrate bonding method

A technology for laminating systems and substrates, applied in chemical instruments and methods, transportation and packaging, conveyor objects, etc., can solve problems such as cracks and substrate damage, and achieve the effect of continuous processing, prevention of substrate damage, and rapid lamination.

Inactive Publication Date: 2016-05-11
LG DISPLAY CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This may cause cracks to occur due to external impact, resulting in damage to the substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate bonding system and substrate bonding method
  • Substrate bonding system and substrate bonding method
  • Substrate bonding system and substrate bonding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0067] Exemplary embodiments will now be described in detail with reference to the accompanying drawings. For ease of brief description with reference to the drawings, the same or equivalent components are given the same reference numerals, and description thereof will not be repeated.

[0068] Generally, the surface roughness of the glass substrate increases for the glass substrate subjected to the etching process. However, the present invention provides an LCD device using a thin glass substrate provided by a glass substrate manufacturing company without an etching process. Due to the glass substrate provided by the glass substrate manufacturing company, etching treatment for reducing the thickness of the glass substrate can be unnecessary, the thin glass substrate has a smooth surface, and can be obtained by using a roughness (Ra) of less than 5.0 nm thin glass substrates to realize LCD devices.

[0069] Especially, in the present invention, the array substrate and the co...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a substrate pasting system and a substrate pasting method. The substrate pasting method comprises the steps introducing the substrate through a substrate-introducing production line; introducing an auxiliary substrate through an auxiliary substrate-introducing production line; pasting the introduced substrate and auxiliary substrate through a pasting production line to form a processing panel used for fully carrying out display apparatus treatment; and separating the two substrate after the treatment is completed, wherein the step of introducing the substrate and the step of introducing the auxiliary substrate are carried out simultaneously or successively.

Description

technical field [0001] The invention relates to a substrate bonding system and a substrate bonding method, and in particular to a bonding production line for a glass substrate of a flat panel display device, and a method for bonding the glass substrate to an auxiliary substrate. Background technique [0002] With the development of various portable electronic devices, such as mobile phones, PDAs, and notebooks, demands for flat panel display (FPD) devices having characteristics of being light, thin, short, and small are increasing. Such FPD devices include liquid crystal display (LCD) devices, plasma display panels (PDP), field emission display (FED) devices, vacuum fluorescent display (VFD) devices, and the like. Among these FDPs, LCD devices have drawn attention due to their advantages such as mass production, easy driving, and high picture quality. [0003] Since LCD devices are mainly used in portable electronic devices, their size and weight should be reduced in order ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333B32B37/00B32B38/00
CPCB65G49/061G01N21/88G02F1/1303H05K3/0097H05K13/0061
Inventor 吴载映金棋容申宇燮李载钧安龙秀
Owner LG DISPLAY CO LTD