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Low dielectric constant polyhedral oligomeric silsesquioxane (POSS)/ epoxy resin hybrid material and preparation method

A technology of epoxy resin and hybrid materials, which is applied in the field of organic polymer materials, can solve the problems of not being able to meet the industrial requirements of high-performance electronic packaging technology and general dielectric properties, and achieve the reduction of dielectric coefficient, excellent dielectric loss, Dielectric Loss Reduction Effect

Inactive Publication Date: 2013-06-12
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The glass transition temperature Tg of ordinary resin materials is low (~130°C), and the dielectric properties are average, which cannot meet the industrial requirements of high-performance electronic packaging technology. Therefore, epoxy resin must be modified.

Method used

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  • Low dielectric constant polyhedral oligomeric silsesquioxane (POSS)/ epoxy resin hybrid material and preparation method
  • Low dielectric constant polyhedral oligomeric silsesquioxane (POSS)/ epoxy resin hybrid material and preparation method
  • Low dielectric constant polyhedral oligomeric silsesquioxane (POSS)/ epoxy resin hybrid material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Example 1: ①. Dissolve 100 parts of bisphenol A epoxy resin and 0 parts of octaepoxy polysilsesquioxane in acetone, stir and blend evenly for 1 to 24 hours, and heat at 80°C Under the pre-reaction, make a homogeneous hybrid resin stock solution A; ②, add an equivalent of 12.43 parts of curing agent and non-essential additives to A solution, stir evenly, and vacuumize at 60°C to remove air bubbles for 20-30min, Obtain prepolymer B; ③. Slowly pour the prepolymer B in step ② into the preheated mold, put it into the oven at 50℃ / 2h+70℃ / 3h+80℃ / 1h for cross-linking and solidification, and cool with the furnace After demoulding, post-treat at 80°C for 4-6 hours to obtain the desired G-POSS / EP nano-hybrid material, and its properties are shown in Table 1.

Embodiment 2

[0026] Example 2: ① Dissolve 95 parts of bisphenol-A epoxy resin and 5 parts of octaepoxy polysilsesquioxane in acetone by mass, stir and blend evenly for 1 to 24 hours, and heat at 80°C Under the pre-reaction, make a homogeneous hybrid resin stock solution A; ②, add an equivalent of 12.54 parts of curing agent and non-essential additives to A solution, stir evenly, vacuumize at 60°C to remove air bubbles for 20-30min, Obtain prepolymer B; ③. Slowly pour the prepolymer B in step ② into the preheated mold, put it into the oven at 50℃ / 2h+70℃ / 3h+80℃ / 1h for cross-linking and solidification, and cool with the furnace After demoulding, post-treat at 80°C for 4-6 hours to obtain the desired G-POSS / EP nano-hybrid material, and its properties are shown in Table 1.

Embodiment 3

[0027] Example 3: ① Dissolve 90 parts of bisphenol-A epoxy resin and 10 parts of octaepoxy polysilsesquioxane in acetone, stir and blend evenly for 1 to 24 hours, and heat at 80°C Pre-react to make a homogeneous hybrid resin stock solution A; ② Add 12.64 parts equivalent of curing agent and non-essential additives to liquid A, stir evenly, vacuumize at 60°C to remove air bubbles for 20-30min, Obtain prepolymer B; ③. Slowly pour the prepolymer B in step ② into the preheated mold, put it into the oven at 50℃ / 2h+70℃ / 3h+80℃ / 1h for cross-linking and solidification, and cool with the furnace After demoulding, post-treat at 80°C for 4-6 hours to obtain the desired G-POSS / EP nano-hybrid material, and its properties are shown in Table 1.

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Abstract

The invention relates to a low dielectric constant polyhedral oligomeric silsesquioxane (POSS) / epoxy resin hybrid material and a preparation method. Epoxy resin and eight epoxy group polyhedral oligomeric silsesquioxane (G-POSS) are evenly mixed in a 80 DEG C breaker according to a certain proportion, an equivalent amount of curing agent triethylene tetramine (TETA) (an amino group in the TETA and an epoxy group in the G-POSS, epoxy resin (EP) are measured according to a 1:1 molar rate) is added and fully stirred, after vacuum defoamation is conducted for 20-30 minutes, the mixture is slowly poured into a preheating mold, conducted solidification in a stove 50 DEG C / 2 hours, 70 DEG C / 3 hours and 80DEG C / 1 hour, cooled to room temperature along with the stove and processed for 4-6 hours after demolding. The low dielectric constant POSS / epoxy resin hybrid material is small in average grain size and excellent in transparent performance, mechanical property and dielectric property.

Description

technical field [0001] The invention relates to a low dielectric coefficient POSS / epoxy resin hybrid material and a preparation method, belonging to the field of organic polymer materials. The good dielectric and mechanical properties of the hybrid material can be widely used in the fields of circuit protection layer materials, LED packaging materials, insulating materials, coatings, adhesives and the like. Background technique [0002] With the rapid development of electronic products towards high speed and high frequency, various electronic and electrical products emerge in endlessly, and their functions are also changing with each passing day. Therefore, the printed circuit board (PcB) is an indispensable main component for most electronic products to achieve circuit interconnection. The performance also puts forward higher requirements. [0003] Epoxy resin is a thermosetting resin widely used. It has excellent mechanical properties, dimensional stability, electrical in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/04C08G59/50C08J3/24
Inventor 刘蓬焦剑蔡宇吴广力
Owner NORTHWESTERN POLYTECHNICAL UNIV
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