Plasma treatment apparatus and plasma treatment method
A plasma and processing device technology, applied in the field of plasma processing, can solve problems such as large distance, inability to maintain inductive coupling, and plasma extinguishment
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Embodiment approach 1
[0037] figure 1 It is a cross-sectional view showing the outline of the plasma processing apparatus according to the first embodiment. figure 1 A state of use of a plasma processing apparatus is shown in which a substrate 2 is placed on a substrate mounting table 1 and a thin film 22 on the surface of the substrate 2 is plasma-treated. figure 1 This is a cross-sectional view of the inductively coupled plasma torch assembly cut along a plane perpendicular to the substrate 2 .
[0038] Such as figure 1 As shown, the plasma processing apparatus includes a substrate mounting table 1 and an inductively coupled plasma torch assembly (hereinafter also referred to as “assembly”) T arranged above the substrate mounting table 1 .
[0039] The module T includes a chamber 20 formed of a dielectric member, and the chamber 20 includes an outer dielectric block 4 having a plasma ejection port 8 at a lower end, and an inner dielectric block 5 arranged at an upper end of the outer dielectric...
Embodiment approach 2
[0072] figure 2 It is a cross-sectional view showing the outline of the plasma processing apparatus according to the second embodiment. figure 2 This is a cross-sectional view of the inductively coupled plasma torch assembly cut along a plane perpendicular to the substrate 2 . The description will focus on differences from Embodiment 1.
[0073] The plasma processing apparatus according to Embodiment 2 has the same configuration as Embodiment 1 except that chamber 20 is replaced with chamber 30 .
[0074] The chamber 30 includes an outer dielectric block 24 having a plasma ejection port 28 at a lower end, and an inner dielectric block 25 arranged at an upper end of the outer dielectric block 24 . The outer dielectric block 24 and the inner dielectric block 25 are formed of dielectric components.
[0075] The outer dielectric block 24 has: a cylindrical outer dielectric block main body 24a in which a plasma generation region is formed; The diameter becomes narrower as it ...
Embodiment approach 3
[0080] Figure 4 and Figure 5 A cross-sectional view showing an outline of a plasma processing apparatus according to Embodiment 3. It is a sectional view obtained by cutting the inductively coupled plasma torch unit T along a plane perpendicular to the substrate.
[0081] Such as Figure 4 As shown, in the plasma processing apparatus of Embodiment 3, in addition to figure 2 The tapered portion 25c is replaced by Figure 4 The structure is the same as that of Embodiment 2 except for the shown truncated conical tapered portion 35c whose bottom surface diameter is larger than the diameter of the protrusion 35b. That is, it is different from Embodiment 2 in that a groove is formed on the side of the inner dielectric block 35 , and a plasma generation region is formed between the groove and the inner wall surface of the outer electrolyte block 24 . Even in such a structure, when CW driving is performed at a high frequency, plasma oscillation occurs in the vertical direction...
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