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Acidic aqueous composition for tin plating

A technology of acidic water and composition, applied in the field of acidic water-based composition for tin electroplating, which can solve the problems of rising production costs of electric and electronic components

Inactive Publication Date: 2013-06-12
YUKEN KOGYO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In addition, in the method disclosed in Patent Document 2, the process of treating with an aqueous solution containing a specific amino acid is an additional process.
As a result, the production cost of electric and electronic components increases

Method used

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  • Acidic aqueous composition for tin plating
  • Acidic aqueous composition for tin plating
  • Acidic aqueous composition for tin plating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0067] (1) Preparation of electroplating solution

[0068] Plating solutions 1-7 shown in Table 1 were prepared.

[0069] 【Table 1】

[0070]

[0071] (2) Plating treatment

[0072] Using each of the obtained plating solutions 1 to 7, plating was performed under the plating conditions described below. In addition, the plated substrate is an open frame printed circuit board formed by nickel plating (amino acid bath, 1 μm) on the wiring formed of Cu1020, and it has been cleaned and activated by a known method.

[0073] Current density: 5, 10, 15A / dm 2

[0074] Plating temperature: 25°C (variation range: ±1°C)

[0075] Total current: 300A sec / dm 2

[0076] Other electroplating conditions mentioned above: Stirring (stirring speed 500rpm), shaking (cathode rocker 5m / min)

[0077] (3) Reflux experiment

[0078] The tin-plated printed circuit board obtained by the above-mentioned plating treatment was left to stand on a hot plate kept at 260° C. for 1 minute, and reflowed....

Embodiment 2）

[0091]Plating solutions 8-10 shown in Table 3 were prepared. Using the obtained plating solutions 8 to 10, respectively, the same plating treatment and reflow test as in Example 1 were performed, and the results were evaluated by the same method as in Example 1.

[0092] 【table 3】

[0093]

[0094] The evaluation results are listed in Table 4.

[0095] 【Table 4】

[0096]

[0097] By comparing the plating solution 1 and the plating solution 8, the following items can be confirmed. That is, by containing the phenanthroline compound, the surface roughness Ra after plating is small. As a result, the surface roughness Ra after reflow was sufficiently smaller than 0.5 μm, and excellent gloss was obtained.

[0098] In addition, by comparing the plating solution 1 with the plating solution 9 and the plating solution 10, it can be confirmed that even if the content of the pyridine-based gloss improving agent is set to 100 ppm, the above-mentioned deterioration of the film app...

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Abstract

Provided is an acidic aqueous composition for tin plating, whereby it becomes possible to prevent the occurrence of the deterioration in coating film appearance in a plated product thereof while eliminating the influence on cost. The acidic aqueous composition for tin plating comprises: a water-soluble tin (II)-containing substance; at least one surfactant selected from the group consisting of a nonionic surfactant and an ionic surfactant having a polyoxyalkylene group; a glossy component comprising an aromatic carbonyl compound; and a glossy aid comprising a pyridine derivative in which position-2 and / or position-4 is substituted by an electron-withdrawing group.

Description

technical field [0001] The invention relates to tin-based electroplating, in particular to an acidic water-based composition for tin electroplating. In the present invention, "tin-based plating" is a general term for plating made of tin and plating made of a tin alloy. Here, plating made of tin includes the case where metals other than tin are contained at impurity levels, and is also referred to as "tin plating." Background technique [0002] Tin-based plating is widely used for contact parts and solder joints in electrical and electronic parts such as semiconductor chip parts, crystal oscillators, capacitors, connector pins, lead frames, and printed circuit boards. Among tin-based plating, glossy plating has the advantages of being less likely to have blemishes and excellent solder wettability compared to matte plating, and is suitable for the above-mentioned applications. [0003] However, when electric and electronic components are subjected to heat treatment such as r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32
CPCC25D3/32C25D5/505
Inventor 楠义则
Owner YUKEN KOGYO