Adhesive film and electronic device including the same

An adhesive film, semiconductor technology, applied in and used in the semiconductor field, can solve the problems of reduced chip shear strength, difficult to remove pores, and deteriorating workability, to ensure pore characteristics, high reliability, and easy removal. , to ensure the effect of reliability

Active Publication Date: 2013-06-19
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, however, the chip shear strength decreases, thus causing deterioration of workability
On the other hand, adhesive films with high storage modulus provide high die shear strength, but make it difficult to remove voids not only in the die attach process but also in the EMC molding process

Method used

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  • Adhesive film and electronic device including the same
  • Adhesive film and electronic device including the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] Preparation of adhesive films for semiconductors containing both amine and phenolic curing agents

[0093] Based on the solid content of 100 parts by weight of the adhesive film, 67.7 parts by weight of elastomer resin (AD-102S, Daiichi Textile Industry Co., Ltd.), 13.5 parts by weight of epoxy resin (EPPN-502H, Japan Chemical Co., Ltd. ), 7.8 parts by weight of amine curing agent (DDS, Wako), 1.5 parts by weight of phenolic curing agent (BPA, KukdoChemical Co., Ltd.) (hydroxyl equivalent: 114g / eq), 0.5 parts by weight of silane coupling agent (S -510, Chisso) and 9 parts by weight of filler (R-972, Degussa) were dissolved in cyclohexanone as an organic solvent, fully kneaded with a bead mill and deposited on the release-treated on PET film. The mixture was then dried in an oven at 100° C. for 20 minutes, thereby preparing an adhesive film for semiconductors having a thickness of 60 μm.

Embodiment 2

[0095] Preparation of adhesive films for semiconductors containing both amine and phenolic curing agents

[0096] In addition to the solid content based on 100 parts by weight of the adhesive film, 12.3 parts by weight of epoxy resin (EPPN-502H, Japan Chemical Co., Ltd.), 5.5 parts by weight of amine curing agent (DDS, Wako) and 5.0 parts by weight of The adhesive film for semiconductor was prepared in the same manner as in Example 1 except for the phenolic curing agent (BPA, Kukdo Chemical Co., Ltd.).

Embodiment 3

[0098] Preparation of Adhesive Films for Semiconductors Containing Both Amine Curing Agents and Phenolic Curing Agents

[0099] In addition to the solid content based on 100 parts by weight of the adhesive film, 11.7 parts by weight of epoxy resin (EPPN-502H, Japan Chemical Co., Ltd.), 3.9 parts by weight of amine curing agent (DDS, Wako) and 7.2 parts by weight of The adhesive film for semiconductor was prepared in the same manner as in Example 1 except for the phenolic curing agent (BPA, Kukdo Chemical Co., Ltd.).

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Abstract

Embodiments provide an adhesive film that contains both an amine curing agent and phenolic curing agent. In more detail, embodiments may provide an adhesive film for semiconductors that may exhibit excellent properties in terms of void characteristics and reliability using an amine curing agent and a phenolic curing agent in a suitable ratio in manufacture of the adhesive film. More particularly, the adhesive film may exhibit a high variation rate of 1.5 to 3.0 between storage modulus before curing and storage modulus after 80% curing. The adhesive film may have flexibility to suppress void generation upon die attachment. The adhesive film may facilitate removal of voids to control a void area on an attachment interface upon EMC (Epoxy Molding Compound) molding. The adhesive film may have hardness to provide good die-shear strength and reflow resistance after curing, thereby ensuring good void characteristics and high reliability.

Description

technical field [0001] The present application relates to an adhesive film for a semiconductor that contains both an amine-based curing agent and a phenol-based curing agent and exhibits excellent properties related to pore characteristics and reliability. More specifically, the present invention relates to an adhesive film for a semiconductor exhibiting a difference between a storage modulus before curing and a storage modulus at 170° C. after 80% curing. High variation ratio of 1.5 to 3.0, flexible for die attach to prevent porosity, EMC (Epoxy Molding Compound) for easy porosity removal during molding to control the porosity area at the attach interface, and hardness to Provides good die shear strength and reflow resistance after curing, ensuring high reliability. Background technique [0002] Recently, with the trend of reduction in size of semiconductor diodes or increase in high capacity, semiconductor diodes are attached to each other with an adhesive film, or attach...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J11/06C09J163/00H01L23/28
CPCC08G59/504C08G59/56C08G59/621H01L24/29H01L24/32H01L2224/2929H01L2224/32225H01L2224/83101H01L2224/2939H01L2224/29391H01L2224/29291H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29386H01L2224/29393H01L2924/181H01L2924/12043C09J163/00H01L2924/00H01L21/48H01L24/50
Inventor 金惠珍崔裁源金志浩金振万宋珪锡
Owner CHEIL IND INC
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