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Adhesive composition, film-like adhesive, adhesive sheet, connection structure and method for producing connection structure

A technology for connecting structures and adhesives, which is applied in the direction of non-polymer adhesive additives, adhesives, adhesive types, etc., can solve the problems of difficult storage stability and low activation energy, and achieve excellent bonding strength and Effect of Connecting Resistance

Active Publication Date: 2013-06-19
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to cure the above-mentioned adhesive at low temperature, it is necessary to use a thermal latent catalyst with low activation energy, but it is very difficult to achieve both storage stability.

Method used

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  • Adhesive composition, film-like adhesive, adhesive sheet, connection structure and method for producing connection structure
  • Adhesive composition, film-like adhesive, adhesive sheet, connection structure and method for producing connection structure
  • Adhesive composition, film-like adhesive, adhesive sheet, connection structure and method for producing connection structure

Examples

Experimental program
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Effect test

Embodiment

[0236] Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited thereto.

[0237]

[0238] (Preparation of Polyester Polyurethane)

[0239] Prepare the resin by dissolving polyester-type polyurethane resin (manufactured by Toyobo Co., Ltd., UR-4800 (trade name), weight-average molecular weight: 32,000, glass transition temperature: 106°C) in a 1:1 mixed solvent of methyl ethyl ketone and toluene A mixed solvent solution with a component of 30% by mass.

[0240] (Preparation of phenoxy resin)

[0241] Dissolve 40 parts by mass of phenoxy resin (trade name: YP-50 (manufactured by Tohto Kasei Co., Ltd.), weight average molecular weight: 60000, glass transition temperature: 80°C) in 60 parts by mass of methyl ethyl ketone to prepare 40 parts by mass of solid content %The solution.

[0242]

[0243] (Synthesis of Urethane Acrylate (UA1))

[0244] In a reaction vessel equipped with a stirrer, a thermometer,...

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Abstract

The invention relates to an adhesive composition, a film-like adhesive, an adhesive sheet, a connection structure and a method for producing the connection structure. The adhesive composition comprises (a) thermoplastic resin, (b) radical polymerized compound, (c) radical polymerized initiator, and (d) salt containing boron. The (d) salt containing boron is a compound expressed by the following formula (A), in the formula (A): R1, R2, R3 and R4 represent hydrogen atoms, 1 to 18alkyl groups or aryl groups of carbon numbers respectively, and X+ represents a cation containing phosphonium atoms or nitrogen atoms.

Description

technical field [0001] The present invention relates to an adhesive composition, a film-like adhesive, an adhesive sheet, a bonded structure, a method for producing a bonded structure, and an application of the adhesive composition. Background technique [0002] In semiconductor elements and liquid crystal display elements, various adhesives have been used conventionally for the purpose of bonding various components in the elements. Requirements for adhesives include many aspects such as adhesiveness, heat resistance, and reliability under high-temperature and high-humidity conditions. The above-mentioned adhesive is used for the connection between liquid crystal display element and TCP (COF), the connection between FPC and TCP (COF), the connection between TCP (COF) and printed circuit board, the connection between FPC and printed circuit board, etc. Moreover, the said adhesive agent is also used when mounting a semiconductor element on a board|substrate. [0003] As an a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/16C09J9/02C09J7/00C09J7/02H05K1/11H05K3/32H01L23/488
CPCC09J9/02C09J11/06C09J171/12C09J175/06C09J175/16C09J2471/00C09J2475/00H05K3/321C08L75/16C08K5/55C08L75/06C08L71/12H01L2224/83101H01L2924/07811Y02E10/50H01L2924/00C09J7/22C09J7/30C09J7/35C09J11/00C09J201/00C09J2203/322C09J2301/41H02S30/10
Inventor 伊泽弘行有福征宏横田弘
Owner RESONAC CORP
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