Chemical copper plating solution
An electroless copper plating and solution technology, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of harming the health of personnel, environmental pollution, pungent formaldehyde smell, etc., and reduce the damage to personnel , Reduce environmental pollution, good coating quality
Inactive Publication Date: 2013-06-19
李平
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Problems solved by technology
[0002] The current electroless copper plating solution contains cyanide and formaldehyde. Although it can improve the bonding strength and smoothness of the product, there is environmental pollution, and the pungent smell of formaldehyde can damage the health of personnel. Therefore, it is necessary to develop a cyanide-free and formaldehyde-free chemical copper plating solution. the solution
Method used
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Embodiment 1
[0008] A kind of electroless copper plating solution, by weight ratio of following composition: copper sulfate pentahydrate 10g / L, copper sulfate 25g / L, sulfuric acid 200g / L, citric acid 50g / L, sodium hypophosphite 120g / L, poly Ethyleneimine alkyl salt 15g / L, thiourea 2g / L, balance water, pH9, temperature 45°C, copper plating time 12 minutes.
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The invention discloses a chemical copper plating solution. The chemical copper plating solution comprises, by weight, 10g / L to 15g / L of blue copperas, 20g / L to 30g / L of copper sulfate, 150g / L to 250g / L of sulfuric acid, 50g / L to 80g / L of citric acid, 100g / L to 150g / L of sodium hypophosphite, 15g / L to 25g / L of polyethylene imine alkyl salt, 1g / L to 5g / L of thiocarbamide and the balance water. Potential of hydrogen (PH) is 8 to 10, temperature is 40 DEG C to 60 DEG C, and copper plating time is 10 minutes to 15 minutes. The chemical copper plating solution is reasonable in formula, has no cyanide and formaldehyde, reduces environmental pollution and harm on staff, and is good in stability of the plating solution, long in service life and good in coating quality.
Description
technical field [0001] The invention belongs to the technical field of surface treatment, and in particular relates to an electroless copper plating solution. Background technique [0002] The current electroless copper plating solution contains cyanide and formaldehyde. Although it can improve the bonding strength and smoothness of the product, there is environmental pollution, and the pungent smell of formaldehyde can damage the health of personnel. Therefore, it is necessary to develop a cyanide-free and formaldehyde-free chemical copper plating solution. solution. Contents of the invention [0003] The purpose of the present invention is to provide a reasonable formula, environmental protection and pollution-free, high product quality, good stability chemical copper plating solution [0004] Technical solution of the present invention is: [0005] A kind of electroless copper plating solution, it is characterized in that, by weight ratio of following composition: cop...
Claims
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IPC IPC(8): C23C18/40
Inventor 李平
Owner 李平
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