Electronic element tinning solution
A technology for tin plating solution and electronic components, applied in the field of tin plating solution for electronic components, can solve the problems of waste, easy blackening of the coating layer, poor stability, etc., and achieve the effects of stable product quality, good plating solution stability and reasonable formula.
Inactive Publication Date: 2013-06-19
李平
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Problems solved by technology
[0002] In order to improve the soldering performance of electronic components with circuit boards, the surface of electronic components is tin-plated. The current tin-plating solution has poor stability, and the plating solution is used for a short time and needs to be replaced frequently, resulting in waste. The coating of the product is prone to blackening and growth of whiskers affecting the product quality
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1
[0008] A kind of tin plating solution for electronic components, by mass proportioning by following composition, tin protosulfate 40g / L, sulfuric acid 180g / L, bismuth sulfate 3g / L, formaldehyde 5g / L, stabilizer 10g / L, remaining Measure distilled water, temperature 30°C, current density 2A / dm 2 .
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The invention discloses an electronic element tinning solution. The electronic element tinning solution comprises, by weight, 30-50g / L of stannous mono-sulphate, 150-200g / L of sulfuric acid, 0.5-4g / L of bismuth sulfate, 2-10g / L of methanal, 10-15g / L of stabilizer, and the rest of the electronic element tinning solution is distilled water. The electronic element tinning solution is reasonable in formula, good in stability of the tinning solution, capable of enabling a plating coating not to prone to growing whiskers due to tin bismuth alloy, and stable in quality of produced products.
Description
technical field [0001] The invention belongs to the technical field of electroplating chemistry, and in particular relates to a tinning solution for electronic components. Background technique [0002] In order to improve the soldering performance of electronic components with circuit boards, the surface of electronic components is tin-plated. The current tin-plating solution has poor stability, and the plating solution is used for a short time and needs to be replaced frequently, resulting in waste. The coating of the product is prone to blackening and growth of whiskers affecting the product quality. Contents of the invention [0003] The object of the present invention is to provide a tin plating solution for electronic components with reasonable formula, good stability of plating solution, good quality of produced products and not easy to grow whiskers. [0004] Technical solution of the present invention is: [0005] A tinning solution for electronic components, whi...
Claims
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IPC IPC(8): C25D3/30
Inventor 李平
Owner 李平