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A kind of conductive powder and conductive silver paste for preparing conductive silver paste

A technology of conductive silver paste and conductive powder, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, and can solve problems such as environmental pollution, conductive wire falling off, and human body hazards

Active Publication Date: 2016-04-27
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defect that the high-temperature sintered conductive silver paste in the prior art causes environmental pollution and harm to the human body during the printing and sintering process, and the conductive circuit obtained by the conductive silver paste is easy to fall off from the substrate. Provide a new conductive powder and conductive silver paste for preparing conductive silver paste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] This embodiment is used to illustrate the preparation of a conductive circuit board using the conductive silver paste of the present invention.

[0035] Mix 70 kg of silver particles with a particle size of 1-5 μm, 12 kg of glass powder with a particle size of 1-5 μm and a softening temperature of 500° C., and 18 kg of portland cement with a hardness of 42.5 in a mixer to obtain conductive powder. The obtained conductive powder and particle diameter are 1.5kg of silicon dioxide, 0.5kg of diethyl phosphate, 0.5kg of methyl acrylate, 1kg of hydroxypropyl methylcellulose, carbon fiber (length is 2 μm, diameter is 0.2 μm) of 15-30nm ) 1kg, 25kg of water and 5kg of ethanol are stirred into a slurry state in a mixer to obtain a conductive silver paste, and the obtained conductive silver paste is printed on a ceramic substrate by screen printing, and then heated to 700°C and cured for 2 hours to form a conductive line , so as to obtain a conductive circuit board. The measured...

Embodiment 2

[0038] This embodiment is used to illustrate the preparation of a conductive circuit board using the conductive silver paste of the present invention.

[0039] Mix 80 kg of silver particles with a particle size of 5-10 μm, 15 kg of glass powder with a softening temperature of 450° C., and 5 kg of portland cement with a hardness of 42.5 in a mixer to obtain conductive powder. The obtained conductive powder and particle diameter are 2kg of silicon dioxide, 0.5kg of diethyl phosphate, 0.5kg of methyl acrylate, 1.0kg of hydroxypropyl methylcellulose, carbon fiber (length is 1 μm, diameter is 0.05 μm) of 30-50nm ) 1.0kg, 20kg of water and 2kg of ethanol were stirred into a slurry state in a mixer to obtain a conductive silver paste, and the obtained conductive silver paste was printed on a ceramic substrate by screen printing, and then heated to 600°C for 3 hours to form a conductive silver paste. line, so as to obtain a conductive circuit board. The measured wiring width of the c...

Embodiment 3

[0042] This embodiment is used to illustrate the preparation of a conductive circuit board using the conductive silver paste of the present invention.

[0043] Mix 75 kg of silver particles with a particle size of 10-20 μm, 2 kg of glass powder with a softening temperature of 550° C., and 23 kg of portland cement with a hardness of 42.5 in a mixer to obtain conductive powder. The obtained conductive powder and particle diameter are 0.3kg of silicon dioxide, 0.04kg of diethyl phosphate, 0.04kg of methyl acrylate, 0.06kg of hydroxypropyl methylcellulose, carbon fiber (length is 2 μm, diameter is 0.5 μm) 0.06kg, 30kg of water and 3kg of ethanol are stirred in a mixer to form a slurry state to obtain a conductive silver paste, and the obtained conductive silver paste is printed on a ceramic substrate by screen printing, and then heated to 800°C and cured for 1 hour to form conductive lines, thereby obtaining a conductive circuit board. The measured wiring width of the conductive li...

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Abstract

The invention discloses conductive powder used for preparing conductive silver paste. The conductive powder is characterized by comprising silver particles, glass powder and silicate cement, wherein the diameter of the silver particles is less than or equal to 20 microns; based on the total weight of the conductive powder, the conductive powder comprises 70-80% by weight of the silver particles, 2-15 by weight of the glass powder and 5-23% by weight of the silicate cement. The invention also discloses conductive silver paste; and the conductive silver paste is characterized by being formed by mixing the conductive powder and a solvent; the conductive powder is the conductive powder according to any of claims 1-5; the solvent is a mixture of water and ethanol; and the weight ratio of the conductive powder, the water and the ethanol is 1: 0.2-0.3: 0.02-0.05. According to the invention, the conductive powder can be preserved for a long time, the conductive silver paste is more environment-friendly and healthier, and a conducting circuit prepared from the conductive silver paste is not easy to fall from a printed material.

Description

technical field [0001] The invention relates to a conductive powder and conductive silver paste for preparing conductive silver paste. Background technique [0002] As an electronic material, conductive silver paste is widely used in the field of conduction. High-temperature sintered conductive silver paste is required in the application of solar cells and capacitor electrodes. The traditional high-temperature sintered conductive silver paste is composed of conductive phase silver, binder phase glass, and organic vehicle (resin + organic solvent). Attached to the surface of the substrate, the resin and organic solvent will volatilize during high-temperature sintering, and the glass phase will melt and become the bonding phase to bond the conductive phase and attach it to the substrate to form a conductive path. The volatilization of organic matter in the printing and sintering process of this kind of conductive silver paste will cause environmental pollution and cause harm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/16H01B1/22
Inventor 富亮王玮高宽
Owner BYD CO LTD
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