Piezoelectric ultrasonic vibration absorption picker

Abstract

The invention discloses a piezoelectric ultrasonic vibration absorption picker which comprises a picking sucker (8), a vibrating plate, a picker shell (7) and an upper cover plate (3). The upper cover plate (3) is connected onto the picker shell (7) by bolts (4), a vibrating cavity is formed between the vibrating plate and the picker shell (7), a vibrating diaphragm (1) and an annular piezoelectric ceramic plate (2) are coaxially adhered with each other to form the vibrating plate, conical holes are uniformly distributed in a middle circular area and a peripheral annular area, which are not in contact with the annular piezoelectric ceramic plate (2), the upper cover plate (3) and the picker shell (7), of the vibrating diaphragm (1), large ends of the conical holes face the vibrating cavity, small ends of the conical holes face the external atmosphere, the picking sucker (8) is arranged on the lower side of the picker shell (7), a channel is arranged in the picker shell (7), the picking sucker (8) can be communicated with the vibrating cavity via the channel, and the lower end of the picker shell (7) extends into the picking sucker (8) and occupies 60-90% of the internal volume of the picking sucker (8).

Description

technical field [0001] The invention relates to an ultrasonic vibration adsorption pickup device utilizing the inverse piezoelectric effect of a piezoelectric ceramic material, in particular to a piezoelectric ultrasonic vibration adsorption pickup. Background technique [0002] With the continuous development of science and technology, the application range of thin and brittle wafer materials such as solar silicon wafers continues to expand. Loading and unloading is very difficult. If the pick-up method is improper, the wafer is easily damaged, and the processed nano-scale surface is easily damaged. Therefore, it is of great significance to design a new, safe, efficient and reliable wafer pick-up device. [0003] At present, vacuum chucks are often used in industrial sites to pick up fragile and thin wafers, but there are some problems in this picking method: [0004] 1. The air source pressure of the vacuum suction cup pickup device is not constant, resulting in unstable...

AI Technical Summary

Problems solved by technology

[0004] 1. The air source pressure of the vacuum suction cup pickup device is not constant, resulting in unstable adsorption and pickup force of the vacuum suction cup;

[0005] 2. The peak value of the suction pick-up force of the vacuum chuck pick-up device is too large, which may occasionally cause chip breakage;

[0006] 3. The suction and pickup force of the vacuum suction cup pickup device is uneven, which is easy to damage the surface quality of the wafer;

[0007] 4. The vacuum suction cup pick-up device has large volume, high power consumption, high cost, high noise and low energy efficiency;

[0008] 5. The suction and deflation reaction time of the vacuum suction cup pick-up device is long and the efficiency is low

[0009] In order to overcome the deficiencies in the above-mentioned vacuum chuck wafer pickup technology, the patent document with the publication number CN102490132A discloses a piezoelectric ultrasonic vibration adsorption picker, which adopts a vibrating cavity, a vibrating disc, a pick-up sucker, a suction The combination of air valve and exhaust valve has the advantages of stable adsorption force change and small environmental pollution. However, the piezoelectric ultrasonic vibration adsorption pickup also has some shortcomings. The suction valve and exhaust valve are ring structures. The effective area ratio of the suction and exhaust valve ports is relatively small, the suction and exhaust speed is slow, and the work efficiency is low, and the manufacturing precision of the annular suction and exhaust valve of the piezoelectric ultrasonic vibration adsorption pickup is high, the processing is difficult, and the assembly is difficult. higher production costs

Images