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A spiral diamond rope

A diamond rope and spiral technology, which is applied in the field of spiral diamond rope, can solve the problems of reduced cutting capacity and easy filling of gaps by chips, so as to reduce waste and improve cutting efficiency.

Active Publication Date: 2015-08-05
盛利维尔(常州)金属材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the cutting capacity of the conventional diamond wire is greatly reduced due to the swarf during the cutting process is easy to fill the gap

Method used

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  • A spiral diamond rope

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Embodiment 1

[0022] Such as figure 1 As shown, the helical diamond rope provided by the present invention includes a steel wire rope formed by twisting two or more steel wires with each other, and a diamond abrasive layer distributed in spiral tracks is attached to the surface of the steel wire rope.

[0023] When the steel wire rope is twisted in S direction, the helical direction of the diamond abrasive layer is distributed in S direction or Z direction. When the steel wire rope is twisted in Z direction, the helical direction of the diamond abrasive layer is distributed in Z direction or S direction.

[0024] Such as figure 1 As shown, the steel wire rope is formed by twisting three steel wires of equal diameter. The diameter of the steel wire is 20 μm to 1 mm. The width L1 of the diamond abrasive layer 1 distributed in a spiral track is 30 μm˜50 mm. The interval width L2 between the diamond abrasive layers 1 is 30 μm-200 mm, depending on the diameter and application of the steel wi...

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Abstract

The invention relates to a spiral diamond rope, which comprises a steel wire rope formed by mutually twisting two or more than two strands of steel wire ropes, wherein the surface of the steel wire rope is attached with diamond grinding materials in spiral track distribution. The spiral diamond rope has diamond grinding particles in spiral distribution, the void can be increased, the chip removal capability is improved, in addition, the cutting efficiency can be improved, and the diamond waste is reduced on the premise of ensuring the cutting effect.

Description

technical field [0001] The invention relates to a helical diamond rope. Background technique [0002] Diamond wire is a high-strength cutting wire with a layer of diamond abrasive particles consolidated on the surface, which is used for cutting hard and brittle materials such as single crystal / polycrystalline silicon, sapphire, gallium arsenide, magnetic materials, and crystal. Compared with the traditional free mortar cutting method, diamond wire cutting technology is a revolutionary progress. The diamond rope cutting process has been widely used by more than 90% of users in Japan, and more than 20% of users in Europe and the United States. At present, diamond ropes in the domestic market are mainly monopolized by foreign companies. In the market of diamond ropes for solar silicon material cutting, Chinese manufacturing is still in a blank state. Domestic diamond ropes for solar silicon material cutting are basically imported, with a high degree of dependence on foreign co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04
Inventor 徐斌盛荣生张明张年春
Owner 盛利维尔(常州)金属材料有限公司