Preparation method of bisphenol A modified paper-base glass cloth copper-clad foil single-sided copper-clad plate

A technology of copper-clad laminates and glass cloth, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of short storage time, poor quality stability, and production difficulties of paper-based prepregs, and achieve High peel strength, stable quality and long storage time

Active Publication Date: 2013-07-24
江阴市明康绝缘玻纤有限公司
View PDF6 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of 6101 epoxy resin is high, it is easy to age after being mixed with phenolic resin, and the cost is high, and the storage time of the paper-base

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0047] Example 1:

[0048] A method for preparing a bisphenol A modified paper-based glass cloth copper-clad single-sided copper-clad laminate, the method includes the following steps:

[0049] 1. Preparation of epoxy-phenolic resin mixed solution:

[0050] Step A, prepare 1134 phenolic resin solution

[0051] The ratio of the raw material mass parts of the 1134 phenolic resin solution is as follows:

[0052] 1100 parts of phenol

[0053] 1150 parts of formaldehyde

[0054] 70 parts of ammonia

[0055] 700 parts of methanol

[0056] During the preparation, phenol, formaldehyde and ammonia are respectively sucked into the reaction kettle, the reaction temperature is 95~100℃, the reaction time is 40~60 minutes, and then the water after synthesis of the resin is removed by vacuum, and methanol is added as a solvent to prepare 1134 Phenolic resin solution.

[0057] Step B, prepare epoxy phenolic resin mixed solution

[0058] The raw material mass ratio of the epoxy phenolic resin mixed solution ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a preparation method of a bisphenol A modified paper-base glass cloth copper-clad foil single-sided copper-clad plate, which comprises the following steps of: (I) preparing an epoxy phenolic resin mixed solution; and (II) preparing a bisphenol A modified phenolic resin mixed solution; preparing a copper-clad foil laminated plate by using the epoxy phenolic resin mixed solution as a steeping binder for glass cloth and the bisphenol A modified phenolic resin mixed solution as a steeping binder for wood fiber paper,. The prepared copper-clad foil laminated plate has low production cost and strong aging resistance, and hardly peels off.

Description

Technical field [0001] The invention relates to a method for preparing a bisphenol A modified paper-based glass cloth copper-clad single-sided copper-clad laminate, which is mainly used in the technical field of copper-clad laminate production. Background technique [0002] Copper clad laminate is a plate-like material made by impregnating electronic fiberglass cloth or other reinforcing materials with resin, and covering one or both sides with copper foil and hot pressing. It is called copper clad laminate ( Copper Clad Laminate, CCL), referred to as copper clad laminate. [0003] Copper clad laminate is an extremely important basic material for printed circuit boards. Printed circuit boards of various forms and functions are selectively processed, etched, drilled and plated on the copper clad laminate. Processes such as copper to make different printed circuits (single-sided, double-sided, multilayer). As the substrate material in the manufacture of printed circuit boards, copp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B32B27/04B32B27/42B32B27/38B32B15/098B32B15/092C08L61/10C08L61/14C08L63/00C08K3/22C08G8/10C08G8/24
Inventor 王宏章陆富才陶雪松
Owner 江阴市明康绝缘玻纤有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products