Wafer processing jig

A jig and wafer technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficulty in ensuring stability and wafer processing quality, and achieve reduced production costs, consistent state, and Consistent results in processing quality

Inactive Publication Date: 2013-07-24
KUNSHAN THETA MICRO
View PDF6 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to facilitate the transfer operation, the traditional Wafer wafer fixing platform generally only supports the central area of ​​the Wafer wafer, and the peripheral area is vacated so that the transfer mechanism can touch the bottom of the Wafer wafer and hold it up. This clamping W

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer processing jig
  • Wafer processing jig
  • Wafer processing jig

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0028] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention will be further explained below in conjunction with specific drawings.

[0029] Reference figure 2 , image 3 , A wafer wafer processing jig, including a carrier platform 1, a suction mechanism is provided on the carrier platform 1, and the suction mechanism includes a plurality of adjustable suction holes 2 arranged in the middle of the carrier platform 1 and a plurality of suction holes arranged on the periphery of the carrier platform 1. A fixed adsorption hole 3. A plurality of fixed suction holes 3 are arranged on the bearing platform 1 in a circular ring shape, and a plurality of regulating suction holes 2 are arranged inside the fixed suction holes 3. A plurality of fixed adsorption holes 3 are connected to a fixed suction device through a gas channel. A plurality of regulating adsorption holes 2 are connected to a reg...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of wafer processing, in particular to a processing jig. A wafer processing jig comprises a bearing platform, wherein an adsorption mechanism is arranged on the bearing platform. The adsorption mechanism comprises a plurality of adjustment adsorption holes formed in the middle of the bearing platform and a plurality of fixing adsorption holes formed in the periphery of the bearing platform. The fixing adsorption holes are formed in the bearing platform in a circular ring shape, and the adjustment adsorption holes are formed in inner sides of the fixing adsorption holes. The fixing adsorption holes are connected with a fixed air suction device through an air channel. The adjustment adsorption holes are connected with an adjustment air suction device through an air channel. Adsorption air pressure of the adsorption holes is adjusted through adjustment of the air suction devices. The wafer processing jig solves clamping and fixing problems of a wafer in processing and proofing stages, and guarantees that the state of a middle area and the state of the periphery of the wafer are consistent so that processing quality is uniform.

Description

[0001] technical field [0002] The invention relates to the technical field of wafer processing, in particular to a processing jig. [0003] Background technique [0004] With the rapid development of semiconductor and chip technology, there are more and more Wafer wafer products of various specifications, and product diversification will inevitably put forward higher requirements for the manufacturing process and quality control of Wafer wafer products. Wafer wafer products generally have specifications ranging from 4 inches, 6 inches, 8 inches, 12 inches or even larger. The overall shape is circular and flat, and the thickness is generally less than 3mm. Its material is a brittle material, and it is very easy to cause the Wafer wafer to be broken and scrapped when it is clamped and fixed during the Wafer wafer transfer and processing. [0005] The traditional wafer processing tool is a high-speed rotary cutting of a diamond grinding wheel. With the increase of device in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67H01L21/683
Inventor 魏志凌宁军蔡猛
Owner KUNSHAN THETA MICRO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap