Compressor, refrigerator and equipment

Abstract

The invention provides a compressor, a refrigerator and an equipment. The invention is provided with a control baseplate carriying a wide bandgap semiconductor in a machine room, and near the compressor or the terminal. In addition, in the invention, the length of a supply lead for connecting the compressor and the control base plate is reduced. According to the invention, the equipment comprises a casing body containing a compressor mechnism part with compressing refrigerating fluid and a motor for rotating and driving the compressing mechenism part; a terminal for power connection, which is arranged on the casing for supplying power for the motor; a terminal box for covering at least one part of the surrouding of the power connection terminal; a control part with a semiconductor element for driving and controlling the compressor; a control base plate case for containing and controlling the base plate. The semiconductor element employs a wide bandgap semiconductor and the control base plate case is detachably installed on terminal case.

Description

technical field [0001] The present invention relates to equipment such as refrigerators and air conditioners using wide bandgap semiconductors as semiconductor components for equipment control. Background technique [0002] With the increasing awareness of energy saving, in recent years, in refrigeration and air conditioning equipment such as air conditioners and refrigerators, low power consumption has been developed. In order to achieve low power consumption, inverter-type equipment that can change the driving frequency of the compressor has become the mainstream. Since the inverter circuit mainly composed of semiconductor components becomes hot, a relatively large heat dissipation structure is required, and there are many structures with a high height in the state of being mounted on the control board. Here, the component height of components other than the inverter circuit mounted on the control board, for example, the height of components related to a large-scale heat ...

AI Technical Summary

Problems solved by technology

[0019] In addition, in the refrigerator described in Patent Document 2, an electrical component storage section for accommodating a control board is provided in a machine room in a high-temperature environment. However, in this electrical component storage section, since the semiconductor element is a conventional Si element, a Semiconductor elements that are not resistant to high temperatures, so in order not to fail due to the influence of the temperature in the high-temperature machine room, it is necessary to install a foam-filled resin enclosure (heat insulation material), the volume of the machine room is reduced and heat insulation The amount corresponding to the thickness of the material, in addition, the cost rises by the amount corresponding to the insulation material

In addition, after taking out the connection wire (lead wire) connecting the control board and the compressor from the resin enclosure, it is necessary to fill the removal hole with a heat insulating material, etc., which takes time and increases costs.

In addition, in order not to be affected by the rising heat of the compressor, the electrical component storage unit cannot be installed directly above the compressor, and the degree of freedom in the arrangement of the electrical component storage unit is reduced.

[0020] In addition, in the compressor described in Patent Document 3, the wide bandgap semiconductor element of the inverter device is installed in the casing of the compressor, so if the wide bandgap semiconductor element fails, it cannot be replaced, and the compressor can only be replaced during maintenance. , the replacement work is laborious, and the replacement cost increases

In addition, since it is installed in the compressor, a refrigerant-resistant structure that does not cause failure due to the refrigerant is required, resulting in an increase in cost

[0021] In addition, in the refrigerating device described in Patent Document 4, since the power element is arranged in the casing of the compressor, in order to install the power element in the curved compressor casing, it is necessary to adjust the shape and mounting method of the heat transfer member. and so on for special research, the cost increases

In addition, since the control board on which the power element is mounted is installed on the discharge piping of the compressor with a diameter of about 10 mm to 15 mm, excessive load and stress are applied to the discharge piping, causing piping breakage and piping vibration. will reduce

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