Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing illuminant on transparent sapphire heat conductive plate

A sapphire, thermally conductive plate technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the light output angle of the lamp, increasing the weight and cost of the lamp, and achieving uniformity, improved heat dissipation characteristics, and improved light efficiency. Effect

Active Publication Date: 2013-08-07
哈尔滨鎏霞光电技术有限公司
View PDF5 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method will reduce the light output angle of the lamp, increase the weight and cost of the lamp

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing illuminant on transparent sapphire heat conductive plate
  • Method for manufacturing illuminant on transparent sapphire heat conductive plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] combine Figure 1-2 In this embodiment, the manufacture of the sapphire heat-conducting light-transmitting plate is mainly carried out in two steps, and the first sapphire heat-conducting light-transmitting plate and the second sapphire heat-conducting light-transmitting plate are manufactured respectively. First, mix yellow phosphor powder and high thermal conductivity epoxy resin glue in a mass ratio of 1:8, and knead three times at 30°C until the phosphor powder and high thermal conductivity epoxy resin glue are evenly mixed. The mixed rubber material is sandwiched between two layers of release paper, and laminated with a film laminating machine to form a phosphor film 2 with a thickness of 500 μm. Cut the phosphor powder film into a suitable size for the sapphire transparent heat conduction plate 1, and use an automatic gluer to paste the phosphor powder film on the 35×1×0.8mm sapphire transparent heat conduction plate 1, and the two ends of the sapphire transparent...

Embodiment 2

[0027] combine Figure 1-2 , the basic steps of this example are the same as Example 1, the difference is that the yellow phosphor is first mixed with the high thermal conductivity epoxy resin glue in a mass ratio of 1:10, and mixed five times at 35°C until the phosphor powder and the high thermal conductivity The epoxy resin glue is mixed evenly. The mixed rubber material is sandwiched between two layers of release paper, and laminated with a film laminating machine to form a phosphor film 2 with a thickness of 500 μm. Cut the phosphor powder film into a suitable size for the sapphire transparent heat conduction plate 1, and use an automatic gluer to paste the film mixed with phosphor powder on the 35×1×0.8mm sapphire transparent heat conduction plate 1, and the two ends of the sapphire transparent heat conduction plate There are metal electrodes 5 for connecting the chip on the sapphire heat-conducting light-transmitting board light-emitting body and other external structur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for manufacturing illuminant on a transparent sapphire heat conductive plate. The method includes two steps: manufacturing a first sapphire heat conducting light-transmitting plate for fixing chips, and manufacturing a second sapphire heat conducting light-transmitting plate which is closely attached with fluorescent powder film. The obtained illuminant on the sapphire heat conducting light-transmitting plates can be connected with an upper wiring plate and a lamp base in a grooved and clamped manner. The method is simple in technology and easy to operate, and heat generated by the chips can be transferred out by not mainly relying on heat radiation, but in a heat conducting manner via a base directly.

Description

(1) Technical field [0001] The invention belongs to the technical field of LED encapsulation, and in particular relates to a method for manufacturing a luminous body on a sapphire transparent heat conduction plate. (2) Background technology [0002] With the deterioration of the global environment and the increasingly prominent problems of resource scarcity, people's demand for energy-saving and environmentally friendly products is also becoming stronger. The electricity required for various lighting in the world is huge, and my country's lighting electricity consumption accounts for about 12% of the total electricity consumption of the whole society. Therefore, the development of energy-saving and environmentally friendly lighting lamps has become a research focus in various countries in recent years. [0003] LED has the advantages of high light efficiency, low energy consumption, long life, environmental protection, etc., and is the most ideal substitute for traditional l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/64
Inventor 左洪波张学军杨舒敏王宽晓褚淑霞
Owner 哈尔滨鎏霞光电技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com