Method for manufacturing LED package

Abstract

The invention discloses a method for manufacturing an LED package. The method includes the following steps: (1) positive electrodes and negative electrodes are respectively arranged on a printing circuit board; (2) LED chips are pasted on the positive electrodes or the negative electrodes through glue, positive poles and negative poles of the LED chips are electrically connected with the positive electrodes and the negative electrodes respectively, and the glue is hardened; (3) a transparent mould is placed on the printing circuit board, the LED chips are placed in an cavity of the transparent mould, mixtures of liquid silicon resin or liquid silicon resin and fluorescent powder are filled in the mould cavity, and the filling material is hardened to be a mould pressing forming portion; (4) the filling material is subjected to drying processing after being molded; (5) the transparent mould is moved out. The manufacturing method has the advantages that on one hand, less materials are used, cost is low, batch production can be achieved, and on the other hand, produced LED chips achieve the effects of high light effect, low light degradation and large light-emitting angle.

Description

technical field [0001] The invention relates to a method for manufacturing an LED light emitting diode package. Background technique [0002] Currently used LED chips include printed circuit boards, LED chips, and molding parts of epoxy resin for encapsulating LED chips. For the molding cavity of the resin, put the liquid epoxy resin into the syringe, apply quantitatively to the LED chip through the dispenser, fill the molding cavity, and harden for 4-5 hours to form the molding part. In order to make the LED chip produce white light, a small amount of phosphor powder is often mixed into the epoxy resin. The phosphor powder coated and filled in the liquid epoxy resin is not only dispersed in any direction, but also the liquid epoxy resin takes a long time to harden. Phosphors with a large specificity of epoxy resin will gather around the LED chip as time goes on, reducing the refractive index of light, resulting in low brightness and large dispersion of white light, and epo...

AI Technical Summary

Problems solved by technology

In order to make the LED chip produce white light, a small amount of phosphor powder is often mixed into the epoxy resin. The phosphor powder coated and filled in the liquid epoxy resin is not only dispersed in any direction, but also the liquid epoxy resin takes a long time to harden. Phosphors with a large specificity of epoxy resin will gather around the LED chip as time goes on, reducing the refractive index of light, resulting in low brightness and large dispersion of white light, and epoxy resin can no longer meet the current market pursuit of high light efficiency and light color. High uniformity, low light attenuation, and high stability of finished products

In the end, there will be problems with price competition, and it will be difficult to survive in the market

Images