Reaction cavity

Abstract

The invention discloses a reaction cavity which comprises a cavity inner liner, a cooling cavity and a purging structure, wherein the purging structure comprises a first air inlet pipe passing through the cooling cavity from the outside of the cooling cavity; the first air inlet pipe is provided with an air outlet at the end arranged towards the cavity inner liner; the direction of the connecting line from the air outlet of the first air inlet pipe to the shortest distance between the cavity inner liner and the surface of the cooling cavity is taken as the first direction; the direction in which the purge gas is guided out from the air outlet is taken as the second direction; an included angle is formed between the second direction and the first direction, so that the diffusion path of the purge gas can be prolonged, the contact area of the inner liner is enlarged, and the cooling effect is reduced; and therefore, the phenomenon of low local temperature of the cavity inner liner can be reduced, and the even airflow field can be formed. Furthermore, the space between the cavity inner liner and the inner wall of the cooling cavity is protected and maintained to be stable, so that the reaction cavity is beneficial to maintaining the reaction to be carried out normally.

Description

technical field [0001] The present invention relates to a semiconductor device, in particular to a reaction chamber which can be used at least in chemical vapor deposition. Background technique [0002] Generally, a chemical vapor deposition chamber such as an MOCVD reaction chamber includes a chamber liner and a cooling chamber. Wherein, the inner lining of the chamber is arranged in the reaction chamber and surrounds the reaction area of ​​the reaction chamber, and the cooling chamber surrounds the inner lining of the chamber so as to isolate the outside. [0003] During the reaction, the reaction area inside the chamber lining is in a high-temperature environment to provide the required reaction environment. In addition, please refer to figure 1 In the prior art, a plurality of gas pipes 3 are arranged in multiple positions around the cooling cavity 2, and the area between the cooling cavity 2 and the cavity liner 1 is blown into in the radial direction of the cooling ca...

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a reaction chamber to at least alleviate the problem in the prior art that the distribution of purge gas affects the uniformity of the reaction in the reaction area

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