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Method for recycling leftover and waste materials of phenolic fireproof insulation board

A technology for fireproof insulation boards and waste materials, applied in the field of foam insulation materials, can solve the problems of high brittleness, application limitation, easy powdering and the like

Inactive Publication Date: 2013-09-11
营口象圆新材料工程技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In terms of the performance of phenolic foam insulation boards, phenolic resin insulation boards also have obvious disadvantages, such as high brittleness and easy pulverization, which limit their application

Method used

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  • Method for recycling leftover and waste materials of phenolic fireproof insulation board

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preparation example Construction

[0013] A preparation method of expandable phenolic resin, comprising the following steps:

[0014] Add 1 mol of phenol and 1.2-1.8 mol of formaldehyde into a three-necked flask equipped with a stirrer, a thermometer and a reflux condenser, turn on reflux heating, and start stirring; when the reaction liquid is 40°C, use 30% KOH aqueous solution to adjust the pH value to 8-9; heat up and control the reaction at 80°C-90°C for 90 minutes; adjust the pH value to 6.5-8.5 with acid, and then dehydrate under reduced pressure at 70°C until cooled to room temperature to obtain expandable phenolic resin.

[0015] The preparation method of filler among the present invention:

[0016] Grind the corners and waste materials of the collected phenolic resin insulation board into fine powder with a pulverizer.

Embodiment 1

[0018] Add 100 parts by weight of resin to the corners of the phenolic resin insulation board, 10 parts by weight of waste materials, 10 parts by weight of polyurethane prepolymer 1#, 4 parts by weight of surfactant H-208, 8 parts by weight of n-pentane, curing agent 18 parts by weight, uniformly stirred in an environment of 20-30° C., and cured at 70° C. to prepare phenolic foam A, whose performance indicators are listed in Table 1.

Embodiment 2

[0020] Add 100 parts by weight of resin to the corners of the phenolic resin insulation board, 15 parts by weight of waste materials, 15 parts by weight of polyurethane prepolymer 1#, 5 parts by weight of surfactant H-208, 10 parts by weight of n-pentane, curing agent 20 parts by weight, uniformly stirred under the environment of 20-30°C, and cured at 70°C to prepare phenolic foam B, whose performance index is shown in Table 1.

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Abstract

The invention provides a method for recycling leftover and waste materials of a phenolic fireproof insulation board. The method comprises the following steps of: firstly, evenly mixing expandable phenolic resin and the leftover and waste materials of the phenolic resin fireproof insulation board, and then adding a polyurethane prepolymer 1# into the mixture; after that, adding a surface active agent and a foaming agent into the mixture; evenly mixing in an environment at 20-30 DEG C; then, adding a curing agent into the mixture for curing at 70 DEG C to prepare phenolic foamed plastics. The method mainly recycles the leftover and waste materials of the phenolic fireproof insulation board as fillers, thus not only alleviating environmental pollution and reducing energy consumption, but also solving the problem of stock of a great deal of leftover and waste materials in the actual production; therefore, the method reduces the industrial cost, is beneficial to improving economic benefits, increases the percentage of close area of the phenolic fireproof insulation board, reduces the water absorption and the brittleness of the phenolic insulation board, improves the strength and the toughness of the phenolic insulation board, and meets the construction demand of a building outer wall.

Description

technical field [0001] The invention belongs to the technical field of foam thermal insulation materials, and in particular relates to a method for recycling and reusing corners and waste materials of phenolic fireproof thermal insulation boards. Background technique [0002] The currently used building insulation materials, phenolic foam plastics, have been widely used as heat insulation materials, sound insulation materials, and building decoration materials due to their characteristics of heat insulation, flame retardancy, low smoke generation, low toxicity, and dimensional stability. and super absorbent materials. At the same time, phenolic foam can be better applied to external wall insulation systems due to its easy-to-obtain raw materials, low price, excellent product performance, flame retardant, self-extinguishing, low smoke, and good waterproof and air permeability. The attention of the material industry. With the increasing scale and industrialization of the pro...

Claims

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Application Information

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IPC IPC(8): C08G18/54C08G18/76C08G18/48C08G18/10C08J9/14
Inventor 吕晟楠刘兵郝帅杨峰
Owner 营口象圆新材料工程技术有限公司
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