Manufacturing method of tsv adapter board and tsv adapter board

Abstract

The invention provides a manufacturing method of a TSV adapter plate and a TSV adapter plate. The method comprises a step of obtaining a substrate and manufacturing a sacrificial layer on the surface of the substrate, a step of manufacturing a through hole in the substrate through the photoetching and etching technology, wherein the through hole penetrates through the substrate and the sacrificial layer, a step of manufacturing an electric conduction pillar and a protruding point at the through hole position, wherein the protruding point is located at the top end of the electric conduction pillar, and the top of the protruding point is higher than the upper surface of the sacrificial layer, a step of removing materials on the upper surface of the sacrificial layer, and a step of removing the sacrificial layer on the upper surface of the substrate, so that the protruding point is obtained at the through hole position. According to the manufacturing method, working procedures are simplified, so that production cost is reduced, production efficiency is improved, and the reliability of the TSV adapter plate is improved.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and relates to a manufacturing method of a TSV adapter plate and the TSV adapter plate. Background technique [0002] With the continuous progress of microelectronics technology, it is no longer possible to meet the actual needs only by integrating more devices on a single chip to improve the performance of the chip. Therefore, stacked chip packaging technology has gradually become the mainstream of technology development. Stacked chip packaging technology is a packaging technology that stacks multiple chips vertically in the same package without changing the size of the package. Among them, the through-silicon via (Through Sivia, TSV) adapter board is a connection board to realize the interconnection of upper and lower chips. The TSV adapter board mainly includes three parts: TSV through hole, transfer circuit and bump, which can not only reduce the The length of the interconnection l...

AI Technical Summary

Problems solved by technology

[0006] It can be seen from the above that the current process of making bumps requires two photolithography processes, which makes the cost of the TSV adapter board relatively high

Moreover, the photoresist is an organic substance, which has a negative impact on the electroplating process, and easily reduces the conductivity of the bumps, thereby reducing the reliability of the electrical connection of the TSV adapter board

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