Board surface roughness inspection method and device

An inspection method and inspection device technology, applied in measurement devices, fluid devices, instruments, etc., can solve the problems of low efficiency, time-consuming and labor-intensive, inability to evaluate the overall roughness of the board surface, etc., and achieve simple structure and efficient inspection. quick effect
CN103308010AActive Publication Date: 2013-09-18GUANGDONG SHENGYI SCI TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDONG SHENGYI SCI TECH
Publication Date
2013-09-18

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Abstract

The invention discloses a board surface roughness inspection method and a board surface roughness inspection device. The method comprises the steps of film forming, film culturing and evaluation, wherein whether a roughening effect is qualified or not is judged according to the film culturing time of a liquid film on a board surface. The inspection method and the inspection device with a simple structure are combined, are simple, reliable and efficient and fast in inspection, and are suitable for industrial online batch full inspection under the condition of not damage.
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Description

technical field

[0001] The invention relates to the technical field of printed circuit boards, in particular to a method and device that can be directly used for testing the surface roughness of insulating boards of multilayer boards. Background technique

[0002] Multilayer board is the inevitable product of the development of electronic technology in the direction of high speed, multi-function, large capacity, portability and low consumption. With the development of electric locomotives towards high-speed microcomputer control, the application of multilayer boards in the locomotive electronics industry is becoming more and more common. Compared with double-sided boards, multi-layer boards have the following four advantages: 1) The design of multi-layer boards is flexible, and it is easy to reserve copper foils in any required places with different layers. These copper foils can eliminate the gap between key circuits. The electrical coupling between them can also be used t...

Claims

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