Board surface roughness inspection method and device

Abstract

The invention discloses a board surface roughness inspection method and a board surface roughness inspection device. The method comprises the steps of film forming, film culturing and evaluation, wherein whether a roughening effect is qualified or not is judged according to the film culturing time of a liquid film on a board surface. The inspection method and the inspection device with a simple structure are combined, are simple, reliable and efficient and fast in inspection, and are suitable for industrial online batch full inspection under the condition of not damage.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method and device that can be directly used for testing the surface roughness of insulating boards of multilayer boards. Background technique [0002] Multilayer board is the inevitable product of the development of electronic technology in the direction of high speed, multi-function, large capacity, portability and low consumption. With the development of electric locomotives towards high-speed microcomputer control, the application of multilayer boards in the locomotive electronics industry is becoming more and more common. Compared with double-sided boards, multi-layer boards have the following four advantages: 1) The design of multi-layer boards is flexible, and it is easy to reserve copper foils in any required places with different layers. These copper foils can eliminate the gap between key circuits. The electrical coupling between them can also be used t...

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Problems solved by technology

Among them, the comparison method is to directly compare the measured surface with the surface roughness sample, which is mainly used in the workshop to evaluate workpieces with large surface roughness values; the light section method is a method of measuring surface roughness using the "light section principle". It is necessary to use a light-section microscope, also known as a double-tube microscope, which is often used to measure the roughness value of Rz from 0.5 to 60 μm. This method is not only time-consuming and labor-intensive, but also inefficient; the interferometric method uses the interference principle of light waves to measure surface roughness The method requires the use of an interference microscope, which is often used to measure the roughness value of Rz from 0.8 to 0.025 μm; the needle drawing method is a contact method for measuring surface roughness, which requires the use of an electric profiler, which is through the stylus and the board surface The detection by direct contact with the surface is a point detection, which is more suitable for laboratory research, but not for industrial production; SEM scanning method is a destructive test, which takes a long time and can only be used for partial inspection; Ra test method The roughness of the sample can be tested quickly and non-destructively, but this method is limited to local single-point inspection and cannot evaluate the overall roughness of the board surface

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