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Manufacturing method for metal semi-hole circuit board

A manufacturing method and circuit board technology, which is applied in the direction of forming electrical connections of printed components, can solve problems such as virtual soldering and weak soldering legs of circuit boards, achieve simple process, avoid weak soldering legs and false soldering, and reduce repair and maintenance costs. The effect of obsolescence costs

Inactive Publication Date: 2013-09-25
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the purpose of the present invention is to provide a kind of manufacturing method of metal semi-hole circuit board, to solve the welding fillet that occurs when the circuit board is carried out follow-up welding because of the burr that occurs at the metallized half-hole orifice. Weakness and Welding Problems

Method used

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Embodiment Construction

[0020] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with specific embodiments.

[0021] The invention provides a method for manufacturing a metal half-hole circuit board, which mainly adjusts the process of the metal half-hole after pattern electroplating and before etching, thereby effectively solving the problem of burr peaking at the hole after the half-hole The problem is to ensure the quality of the product without increasing the production process of the product.

[0022] Wherein the present invention mainly adopts following steps:

[0023] a. Drill holes on the circuit substrate;

[0024] The drilled holes include via holes, half-through holes, blind via holes and buried via holes, and the via holes refer to the holes used for conductive interconnection between the upper layer and the layer of the multilayer circuit board; the half-through holes retain the original The conduc...

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Abstract

The invention discloses a manufacturing method for a metal semi-hole circuit board. According to the manufacturing method, after an outer layer graph of the circuit board is manufactured, graph electrolytic tinning treatment is carried out, tinning is carried out on the circuit graph and a drill hole needing to be protected, then a semi-hole is milled in the position of the drill hole, burr flashes are formed in the position of the hole opening after the semi-hole is milled, and then the etching treatment is carried out. As the circuit graph and the drill hole are protected by tinning, the burr flashes in the position of the hole opening are not tinned and can be etched off while the whole circuit graph and the drill hole are not influenced. Compared with the prior art, the manufacturing method is simple in process, avoids the problems of unsecured welding legs and cold solder joints occurring when follow-up welding is carried out on the circuit board, effectively solves the problem of production scrap, and lowers the maintenance cost and the scrap cost caused by the problem of the burr flashes.

Description

Technical field: [0001] The invention belongs to the technical field of printed circuit board production, and specifically relates to a method for producing a metal half-hole circuit board. Background technique: [0002] In the circuit board manufacturing industry, there are usually designs with metallized half-holes on the edge of the board. When this type of design is made according to the traditional gong board process, there is a problem that the edge remains. When metallizing the half-hole of the gong, since the gong knife enters the hole on the entrance side of the metallized half-hole, the copper skin will be in a state of no force support, and the copper skin on the wall of the side hole will follow the rotation of the gong knife, Burrs and peaks are formed at the mouth. [0003] With the continuous development of electronic products, customers have more and more diversified requirements for metallized half-holes on the edge of the board. At the same time, the quali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
Inventor 常文智彭卫红宋建远王海民
Owner SHENZHEN SUNTAK MULTILAYER PCB
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