Unlock instant, AI-driven research and patent intelligence for your innovation.

A thermosetting resin composition with good insulation, prepreg and metal clad board

A thermosetting, composition technology, applied in metal layered products, layered products, chemical instruments and methods, etc., can solve problems such as poor insulation, and achieve the effects of improving workability, low friction coefficient, and good insulation

Active Publication Date: 2016-05-25
GUANGDONG SHENGYI SCI TECH
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The purpose of the present invention is to provide a thermosetting resin composition for the problem of poor insulation after the currently used resin solution is made of a metal clad board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A thermosetting resin composition with good insulation, prepreg and metal clad board
  • A thermosetting resin composition with good insulation, prepreg and metal clad board
  • A thermosetting resin composition with good insulation, prepreg and metal clad board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The preparation of embodiment 1 filler A1-A4

[0047] Fillers A1-A4 were prepared by using the preparation method provided by the present invention with different raw material ratios according to the component contents of the fillers of the present invention, and their compositions and mass percentages are shown in Table 1.

Embodiment 2

[0063] The preparation of embodiment 2 resin composition

[0064] The fillers prepared in Example 1 and Comparative Example of the present invention were prepared into a resin glue solution for copper clad laminates with methyl ethyl ketone, in which the solid content accounted for 65%, and its components and contents are shown in Table 3.

[0065] table 3

[0066]

[0067]

[0068] The material used in the embodiment and its composition are as follows:

[0069] Thermosetting resin A is bisphenol A type epoxy resin produced by Dow Chemical, the trade name is DER530, and the epoxy equivalent is 435g / eq.

[0070] Thermosetting resin B is a novolac epoxy resin produced by Hexion Chemical Company of the United States (formerly Bolton Chemical Company of the United States and Beckett Company of Germany), the trade name is EPR627-MEK80, and its epoxy equivalent is between 160-250g / eq.

[0071]The curing agent is a phenolic resin curing agent produced by Hexion Chemical Compa...

Embodiment 3

[0073] Example 3 Copper-clad laminates were prepared using the fillers prepared in the present invention and the fillers prepared in the comparative example

[0074] (1) Glue making: Add the solvent into the batching container, and add the thermosetting resin, curing agent solution and curing accelerator solution respectively under stirring; after stirring for 2 hours, add the filler, continue stirring for 4-8 hours, take a sample to test the glue The gelling time (170°C constant temperature hot plate) is 200-300 seconds.

[0075] (2) Impregnation: Pass the reinforced material layer soaked in glue through a vertical or horizontal impregnation machine, and control the extrusion wheel speed, line speed, wind temperature and furnace temperature. The specific example of the vertical impregnation machine is : Extrusion wheel speed: -1.3~-2.5±0.1M / min; Main line speed: 4~18m / min; Air temperature: 120~170℃; Furnace temperature: 130~220℃, to make prepreg.

[0076] (3) Pressing: After...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to a thermosetting composition for a metal-clad foil plate. The thermosetting composition comprises the following components in percentage by weight: 20-70 percent of thermosetting resin, 1-30 percent of curing agent, 0-10 percent of accelerant and 1-50 percent of composite silica amorphous eutectic powder, wherein the composite silica amorphous eutectic powder comprises the following components in percentage by weight: 50-70 percent of silica, 5-25 percent of aluminum oxide, 3-20 percent of diboron trioxide, less than or equal to 5 percent of calcium oxide and less than or equal to 4 percent of magnesium oxide. According to the thermosetting composition provided by the invention, the processability of an electronic substrate is improved, and the prepared metal-clad foil plate has high insulating property.

Description

technical field [0001] The invention relates to a thermosetting resin composition, in particular to a thermosetting resin composition for a metal foil clad board. Background technique [0002] Metal foil clad board is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin solution, covering one or both sides with metal foil and hot pressing. It is called metal foil clad laminate ( CopperClad Laminate, CCL), referred to as metal clad. Metal clad board is the substrate material for the manufacture of printed circuit boards (Printed Circuit Board, referred to as PCB), PCB is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are used for the electrical in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L79/04C08L71/12C08L79/08C08K13/06C08K9/06C08K9/04C08K3/36C08K3/22C08K3/38C08J5/04B32B15/08
Inventor 柴颂刚许永静
Owner GUANGDONG SHENGYI SCI TECH