Novel high-power LED light source and implementation method thereof

Abstract

The invention relates to a novel high-power LED light source and an implementation method of the novel high-power LED light source. An existing LED light source is poor in lighting effect, poor in heat dissipation and high in cost. The novel high-power LED light source is composed of a ceramic substrate, electronic dam glue, high-power LED chips, fluorescence glue, silica glue, key alloy lines, high thermal conductive silver paste and silver paste. The ceramic substrate is in a sheet shape, installation holes are formed in the edges of the ceramic substrate, superfine small holes are formed in the ceramic substrate and are filled with the silver paste in a pouring mode, and the electronic dam glue is arranged on the ceramic substrate; the high-power LED chips are bonded within the range of the electronic dam glue on the ceramic substrate; the key alloy lines are connected with electrodes of the high-power LED chips and the ceramic substrate; the florescence glue is arranged on the surfaces of the high-power LED chips on the ceramic substrate, and one layer of silica glue is arranged on the surface of the florescence glue. The implementation method of the novel high-power LED light source comprises the steps: punching the holes, filling the holes with the silver glue, arranging the electronic dam glue, fixing the high-power LED chips, connecting the key alloy lines, coating the fluorescence glue, and pouring and solidifying the silica glue under the high temperature. The novel high-power LED light source is easy to assemble and disassemble, safe, waterproof and long in service life, energy is saved and popularization is facilitated.

Description

technical field [0001] The invention relates to the technical field of electronic lighting, in particular to a novel high-power LED light source and a realization method thereof. Background technique [0002] The substrate is the key to the heat dissipation of the LED light source. The light efficiency decreases with the increase of the temperature. The heat dissipation of the substrate directly affects the light output efficiency of the LED lamp. At present, the commonly used integrated packaging method of high-power LED light source is to inject PPA on the copper or aluminum substrate to form the lamp cup, and then carry out the process of solid crystal, help wire, dispensing, spectroscopic test, packaging and other processes on it. There are disadvantages of low light efficiency, poor heat dissipation, and high cost. The brightness and life of the product cannot be guaranteed, especially in some relatively harsh environments. Contents of the invention [0003] The o...

AI Technical Summary

Problems solved by technology

At present, the commonly used integrated packaging method of high-power LED light source is to inject PPA on the copper or aluminum substrate to form the lamp cup, and then carry out the process of solid crystal, help wire, dispensing, spectroscopic test, packaging and other processes on it. There are disadvantages of low light efficiency, poor heat dissipation, and high cost. The brightness and life of the product cannot be guaranteed, especially in some harsh environments.

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