Defect inspection method, defect inspection apparatus, and method for manufacturing substrate
A defect inspection and defect location technology, applied in the direction of measuring devices, material defect testing, optical devices, etc., can solve the problems of heavy operator burden, difficulty in determining the location, and wrong location of defects, etc.
Inactive Publication Date: 2013-10-30
SHARP KK
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Problems solved by technology
However, in array inspection, even if it is possible to detect whether there is a defect in the wiring part, it is difficult to identify the position of the defect
[0004] For example, as an inspection method for identifying defect locations, there is a visual inspection in which an operator observes a substrate with a microscope, but this inspection method places a heavy burden on the operator, and it may be difficult to identify defects by visual inspection. lead to misplacement of defects
Method used
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Embodiment 1
[0028] figure 1 It is a block diagram showing the structure of the defect inspection apparatus 100 of the first embodiment. The defect inspection device 100 of Embodiment 1 inspects defects such as wiring on a plurality of liquid crystal panels 2 formed on the mother substrate 1, and includes: a probe 3 for conducting with the liquid crystal panel 2; The probe moving unit 4 that moves on the liquid crystal panel 2; the infrared camera 5 that is used to obtain the infrared image; the camera moving unit 6 that makes the infrared camera 5 move on the liquid crystal panel 2; and the probe moving unit 4 and the camera moving unit 6 The main control unit 7 that performs control.
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According to one embodiment of the present invention, a defect inspection method for detecting a defect position on a mother substrate having a plurality of wiring substrates formed thereon includes: a step of detecting a defective substrate, which has a defective portion, or a defective block, which includes the defective portion, by performing resistance inspection to each of the wiring substrates; a step of having the defective portion generate heat by applying a voltage to the defective substrate or the defective block; a step of photographing, by means of a first infrared camera, the defective substrate or the defective block where the defective portion has generated heat; and a step of measuring the position of the defective portion by means of macro-measurement, on the basis of an image photographed by means of the first infrared camera.
Description
technical field [0001] The invention relates to a wiring defect inspection method and a defect inspection device, which are suitable for defect inspection of wiring substrates formed with multiple wirings, such as liquid crystal panels and solar battery panels. Background technique [0002] As an example of a wiring board, for example, the manufacturing process of a liquid crystal panel is roughly divided into a matrix (TFT) process, a cell (liquid crystal) process, and a module process. Among them, in the array process, after the gate electrode, semiconductor film, source / drain electrode, protective film, and transparent electrode are formed on the transparent substrate, the array inspection is performed to check whether there is a short circuit in the electrode, wiring, etc. Defects such as disconnection. [0003] Usually, in array inspection, the above-mentioned defects are detected by contacting the end of the wiring with a probe to measure the resistance at both ends o...
Claims
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IPC IPC(8): G01N21/956G01B11/00G01N25/72G01N27/20G01R31/02
CPCG09G2360/147G01R31/309G09G3/006G01N21/956G01N25/72G01N2021/9513G01N21/95G01N27/20
Inventor 柳濑正和
Owner SHARP KK
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