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Preparation method for high temperature-resistant polysulfonamide sheet material

A kind of polysulfone fiber and high temperature resistant technology, which is applied in the field of preparation of high temperature resistant polysulfone fiber sheet, can solve the problems of low strength, weak, many gaps in the sheet, and achieve the effect of high strength, high fracture stress and uniform texture

Inactive Publication Date: 2013-11-06
SHANGHAI WEAVING SCIENCE RESEARCH INSTITUTE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since polysulfone fiber is a material with no melting point, if polysulfone fiber is to be made into a plate-shaped profile, there are two methods in the past: generally, it needs to be mixed with resin to form a plate, but this does not fully reflect the polysulfone fiber. The heat-resistant properties of rayon, and the strength of the board at high temperature is also low; another method is to suck the solvent from the polymer slurry after polymerization under high temperature vacuum, and form a board of arylsulfone fiber polymer after the solvent evaporates. Although this type of board is completely made of sulfonamide, this board has more voids, the material is loose and not strong, and its strength is low.

Method used

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  • Preparation method for high temperature-resistant polysulfonamide sheet material
  • Preparation method for high temperature-resistant polysulfonamide sheet material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] (1) Pre-compression molding: add sulfonamide powder into the mold at room temperature, and use 100kg / cm 2 Take it out after pressure compaction and forming, it is a prefabricated part;

[0017] (2) High temperature preheating: heat the mold to 220°C, put the plate into the mold, heat the plate to 320°C, and keep it at this temperature for 20 minutes;

[0018] (3) High temperature and high pressure pressing: keep at 320°C, pressurize the plate to 600kg / cm 2 , keep the plate at 600kg / cm 2 pressurize for 15 minutes;

[0019] (4) High-pressure cooling: start cooling without pressure relief, that is, keep the pressure at 600kg / cm 2 , use the cooling water system in the platen to cool the plate, the temperature of the cooling water is 30°C, and it takes 30 minutes to cool the temperature of the plate from 320°C to 250°C;

[0020] (5) Natural cooling: release the pressure to normal pressure, take out the board, and cool it to normal temperature in the natural environment, ...

Embodiment 2

[0022] (1) Pre-compression molding: add sulfonamide powder into the mold at room temperature, and use 120kg / cm 2 Take it out after pressure compaction and forming, it is a prefabricated part;

[0023] (2) High temperature preheating: heat the mold to 220°C, put the plate into the mold and heat to 350°C and keep it for 20 minutes;

[0024] (3) High temperature and high pressure pressing: keep at 350°C and pressurize to 500kg / cm 2 , keep the 500kg / cm 2 pressure for 5 minutes;

[0025] (4) High-pressure cooling: In the state of not releasing the pressure, use the cooling water system in the pressure plate to cool the plate. The temperature of the cooling water is 80°C, and the cooling starts, that is, the pressure is kept at 500kg / cm 2 , it took 90 minutes to cool the temperature of the plate from 350°C to 250°C;

[0026] (5) Natural cooling: release the pressure to normal pressure, take out the board, and cool it to normal temperature in the natural environment to obtain the...

Embodiment 3

[0028] (1) Pre-compression molding: add sulfonamide powder into the mold at room temperature, and use 120kg / cm 2 Take it out after pressure compaction and forming, it is a prefabricated part;

[0029] (2) High temperature preheating: heat the mold to 220°C, put the plate into the mold, heat the plate to 350°C, and keep it at this temperature for 25 minutes;

[0030] (3) High-temperature and high-pressure pressing: Keep the temperature at 350°C and pressurize the plate to 400kg / cm 2 , keeping the plate under pressure for 10 minutes;

[0031] (4) High-pressure cooling: In the state of not releasing the pressure, use the cooling water system in the pressure plate to cool the plate, the temperature of the cooling water is 60°C, start cooling, that is, keep the pressure at 400kg / cm 2 , it takes 60 minutes to cool the temperature of the plate from 350°C to 250°C;

[0032] (5) Natural cooling: release the pressure to normal pressure, take out the board, and cool it from 250°C to n...

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Abstract

The invention discloses a preparation method for a high temperature-resistant polysulfonamide sheet material. The preparation method comprises the following steps: (1) subjecting powdery polysulfonamide to pre-pressing molding at normal temperature, wherein pressure is controlled to be 100 to 300 kg / cm<2>; (2) carrying out preheating at a temperature of 300 to 400 DEG C for 5 to 60 min; (3) carrying out compacting at the temperature of 300 to 400 DEG C, wherein pressure is controlled to be 300 to 600 kg / cm<2>, and compacting time is 1 to 30 min; (4) cooling to a temperature of 250 DEG C under the condition of no pressure relief, wherein time for cooling is 30 to 120 min; and (5) carrying out pressure relief until normal pressure is obtained, taking out the sheet material and naturally cooling the sheet material to normal temperature. The polysulfonamide sheet material prepared in the invention has a uniform texture, high strength, certain wear resistance at a high temperature and excellent heat resistance and is applicable to heatproof structural members, insulating boards, sealing plates, friction bearings, etc. used at a high temperature.

Description

technical field [0001] The invention relates to a preparation method of a board, in particular to a preparation method of a high-temperature-resistant polysulfone fiber board. Background technique [0002] Aromatic polysulfoneamide fiber is a kind of fiber containing sulfone group (-SO 2 -) aromatic polyamide fiber, which is a ternary random copolymer, the English name is Polysulfonamidefibre, referred to as polysulfonamide fiber, also known as PSA fiber. There is a strong electron-absorbing sulfone group on the main chain of the sulfone fiber macromolecule. Through the double bond conjugation of the benzene ring, the molecular structure of the sulfone fiber fiber is stabilized, and it has good hydrolysis resistance, flame retardancy and high temperature resistance. . [0003] Since polysulfone fiber is a material without a melting point, if polysulfone fiber is to be made into a plate-shaped profile, there are two methods in the past: generally, it needs to be mixed with ...

Claims

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Application Information

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IPC IPC(8): B29C43/02B29C43/58B29L7/00
Inventor 汪晓峰林银芳
Owner SHANGHAI WEAVING SCIENCE RESEARCH INSTITUTE CO LTD
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