Light source adopting LED chip packaging technology
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 江西量一光电科技有限公司
- Publication Date
- 2013-11-13
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of LED optics, in particular to a light source of LED chip packaging technology. Background technique
[0002] The existing LED-COB packaging technology, which includes the substrate, the LED chip fixed on the substrate, the apron formed on the substrate and the fluorescent powder adhesive layer in the apron, is implemented. More specifically, the existing COB surface light source The traditional form of packaging is a single-layer phosphor adhesive surface, that is, a layer of fluorescent adhesive is covered on the LED chip.
[0003] In terms of application, another example is Chinese Patent No. 2010206457499, which is named: an LED lamp and lamp for optical processing with a reflective cup combined with a lens. Disclosed is an LED lamp and lamp optically treated with a reflective cup combined with a lens, which combines the reflective cup and the lens by setting an optical processing part to mix the light...