Light source adopting LED chip packaging technology

An LED chip and technology technology, applied in the field of LED optics, can solve the problems of the heat of the LED chip cannot be released in time, it is not easy to illuminate the reflector cup, and the cost of optical components is increased, so as to facilitate development and application, increase the number of chips, and increase the area. Effect
CN103390716AInactive Publication Date: 2013-11-13江西量一光电科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
江西量一光电科技有限公司
Publication Date
2013-11-13
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a light source adopting an LED chip packaging technology. The light source comprises a copper substrate and LED chips, wherein a bulged part is formed in the center of the copper substrate; a plurality of LED chips are fixedly connected on the surface of the bulged part; a protective adhesive layer, a transparent filling adhesive layer and a fluorescent powder adhesive layer are sequentially arranged on each LED chip; the whole bulged part is covered with the three adhesive layers; and an optical lens is fixedly connected onto the top of the bulged part covered with the adhesive layers. According to the light source adopting the LED chip packaging technology, main center light rays are converged, so that the luminous efficiency is improved; and surrounding light rays are all reflected to provide illumination, and light spots are uniform.
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Description

technical field

[0001] The invention relates to the technical field of LED optics, in particular to a light source of LED chip packaging technology. Background technique

[0002] The existing LED-COB packaging technology, which includes the substrate, the LED chip fixed on the substrate, the apron formed on the substrate and the fluorescent powder adhesive layer in the apron, is implemented. More specifically, the existing COB surface light source The traditional form of packaging is a single-layer phosphor adhesive surface, that is, a layer of fluorescent adhesive is covered on the LED chip.

[0003] In terms of application, another example is Chinese Patent No. 2010206457499, which is named: an LED lamp and lamp for optical processing with a reflective cup combined with a lens. Disclosed is an LED lamp and lamp optically treated with a reflective cup combined with a lens, which combines the reflective cup and the lens by setting an optical processing part to mix the light...

Claims

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