Thermistor temperature sensor and manufacturing method thereof

Abstract

The invention belongs to the technical field of thermosensitive chip products, and particularly discloses a thermal resistor temperature sensor and a manufacturing method thereof. The thermal resistor temperature sensor comprises an LED support, wherein a concave part is arranged on one side of the head part of the LED support; a thermosensitive chip is fixed after the concave part is subjected to silver adhesive gluing solidification; an electrode wire is connected between the thermosensitive chip and the upper part of the other side of the head part of the LED support; an epoxy resin wrapping casing is wrapped on the head part of the LED support and the thermosensitive chip. The manufacturing method of the thermal resistor temperature sensor is used for enabling the electrode wire to be connected onto the thermosensitive chip through the adoption of a bonding method. The thermal resistor temperature sensor has high automation degree, excellent product consistency and excellent packaging effect, can effectively meet the requirements for various performance such as the reliability and tightness of the products, quick response and the like.

Description

technical field [0001] The invention belongs to the technical field of thermosensitive chip products, in particular to a thermistor temperature sensor and a manufacturing method thereof. Background technique [0002] With the development of electronic technology, electronic components will develop in the direction of high performance, miniaturization, chip and thin film. The standardized design of the pins of electronic components has incomparable advantages: easy installation and high efficiency, electrodes in the epoxy packaging layer - higher reliability. [0003] At present, thermistors and temperature sensors, which use thermal chips as the core components and adopt different packaging forms, are widely used in various temperature detection, temperature compensation, and temperature control circuits. The central role of the required electronic signal. [0004] Due to the wide application of thermistors, in order to meet the market demand, this requires manufacturers t...

AI Technical Summary

Problems solved by technology

[0011] First, it is easy to solder poorly: when the heat-sensitive chip is clamped by two leads and dipped in the tin furnace, due to the difference in the temperature of the tin furnace, the difference in the time of tin immersion, and the difference in the quality of the tin, it will cause damage to the heat-sensitive chip. Connecting tin to form a short circuit, directly resulting in poor performance;

[0012] Second, it is easy to package poorly: when packaged, the heat-sensitive chip 1' after soldering the leads is dipped in epoxy resin in the epoxy resin package groove, and then cured under certain curing conditions

Due to the inclination of the heat-sensitive chip 1' during soldering, or the difference in the viscosity of the epoxy resin, the size of the packaged head of the packaged product is uneven and inconsistent, which makes the product packaging effect poor and the pass rate of the product is greatly reduced.

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