Wafer-level packaging structure and packaging method of image sensor

Abstract

The invention relates to a wafer-level packaging structure and packaging method of an image sensor. The wafer-level packaging structure of the image sensor comprises a wafer to be packaged, a pad and an image sensing area which are positioned on the first surface of the wafer to be packaged and positioned in a chip region, a first cofferdam structure positioned on the surface of the pad and the surface of a cutting channel region, a packaging cover which is arranged by being opposite to the first surface of the wafer to be packaged, and a second cofferdam structure positioned on the surface of the packaging cover, wherein the position of the second cofferdam structure corresponds to that of the cutting channel region, and the packaging cover and the wafer to be packaged are fixedly jointed by utilizing the second cofferdam structure and the first cofferdam structure. According to the wafer-level packaging structure and packaging method, during the packaging process, the mechanical strength and cavity ratio between the wafer to be packaged and the packaging cover are ensured, the packaging cover can be automatically separated from the wafer to be packaged at the end of a packaging process, and the wafer to be packaged can not be damaged.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to a wafer-level packaging structure and packaging method of an image sensor. Background technique [0002] As the size of the image sensor becomes smaller and the integration level continues to increase, the number of pads increases and the spacing between the pads becomes narrower. Correspondingly, higher requirements are placed on the packaging of the image sensor. [0003] The traditional image sensor packaging method is usually packaged by wire bonding (Wire Bonding). However, with the rapid development of integrated circuits, longer leads make the product size unable to meet the ideal requirements. Therefore, Wafer Level Packaging (Wafer Level Packaging) Package, WLP) has gradually replaced wire bonding packaging as a more commonly used packaging method. Wafer Level Packaging (WLP) technology is a technology that performs packaging and testing on the entire wafer and then...

AI Technical Summary

Problems solved by technology

However, even if the package cover is transparent, it will still affect the transmission of light, making the reception and emission of light in the photosensitive area of ​​the image sensor difficult, thereby affecting the overall performance of the chip. Lid and Wafer Peeled Off

[0005] However, how to easily and conveniently peel off the package cover from the wafer without damaging the wafer is still a problem

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