High-refractive-index organosilicon material for light-emitting diode (LED) packaging and preparation method of high-refractive-index organosilicon material

An LED packaging, high refractive index technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low LED luminous flux, poor waterproof effect, poor mechanical strength, etc., to ensure mechanical strength, improve anti-vulcanization performance, The effect of prolonging life

Active Publication Date: 2013-01-09
东莞市贝特利新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, most of the silicone materials used for LED packaging are materials with ordinary refractive index, and its refractive index is (1.41-1.43), but the LED luminous flux packaged with this ordinary refractive index silicone material has low luminous flux and waterproof effect. bad
In order to pursue a higher luminous flux, the LED packaging industry gradually adopts phenyl-modified silicone materials for LED packaging. This phenyl-modified silicone material has a high refractive index of (1.51-1.56). The light transmittance of packaged LEDs is generally increased by 5-10%, and the water resistance is also better than ordinary refractive index. However, the disadvantages of using phenyl-modified silicone materials in the prior art are: bonding with the substrate Poor strength, poor mechanical strength, easy to be brittle at high temperature, etc., greatly limit its use, so the LED packaging industry urgently needs to develop a high-refractive-index silicone material with strong adhesion and strong mechanical properties

Method used

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  • High-refractive-index organosilicon material for light-emitting diode (LED) packaging and preparation method of high-refractive-index organosilicon material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Take 1000g general formula as (Me 2 ViSiO 0.5 ) 1 (PhSiO 1.5 ) 5 The vinyl phenyl silicone resin, 500g general formula is (Me 2 HSio 0.5 ) 1 (PhSiO 1.5 ) 5 The hydrogen-containing phenyl silicone resin, 50g of nano-silica (particle size distribution 5-10nm) treated with γ-glycidyl etheroxypropyl trimethoxysilane, a total of three materials were put into a 2L internal mixer, and internally mixed for 1 hour, then add 0.1g of platinum catalyst with a platinum content of 500ppm in a nitrogen atmosphere, banbury for 10 minutes, and finally add 0.1g of methylpentynol, and continue banbury for 10 minutes to obtain a high refractive index silicone material. Take out 100g of the mixture and vacuumize it and place it in the tablet-making mold and the adhesion test mold respectively, and test the mechanical tensile strength and adhesion after curing is complete.

Embodiment 2

[0024] Take 1000g general formula as (Me 2 ViSiO 0.5 ) 20 (PhSiO 1.5 ) 50 (Ph 2 SiO) 50 (Me 3 SiO 0.5 ) 20 The vinyl phenyl silicone resin, 600g general formula is (Me 2 HSio 0.5 ) 10 (PhSiO 1.5 ) 50 (Me 3 SiO 0.5 ) 10 The hydrogen-containing phenyl silicone resin, 50g of nano-silica (particle size distribution 5-10nm) treated with γ-glycidyl etheroxypropyl trimethoxysilane, a total of three materials were put into a 2L internal mixer, and internally mixed for 1 hour, then add 0.1g of platinum catalyst with a platinum content of 500ppm in a nitrogen atmosphere, banbury for 10 minutes, and finally add 0.1g of methylpentynol, and continue banbury for 10 minutes to obtain a high refractive index silicone material. Take out 100g of the mixture and vacuumize it and place it in the tablet-making mold and the adhesion test mold respectively, and test the mechanical tensile strength and adhesion after curing is complete.

Embodiment 3

[0026] Take 1000g general formula as (Me 2 ViSiO 0.5 ) 20 (PhSiO 1.5 ) 50 (Ph 2 SiO) 50 (MeViSiO) 50 (MePhSiO) 50 (Me 3 SiO 0.5 ) 20 The vinyl phenyl silicone resin, 400g general formula is (Me 2 HSio 0.5 ) 20 (PhSiO 1.5 ) 50 (Ph 2 SiO) 50 (MeHSiO) 50 (MePhSiO) 50 (Me 3 SiO 0.5 ) 20 A total of three materials including hydrogen-containing phenyl silicone resin and 50g of nano-silica (particle size distribution 10-15nm) treated with γ-methacryloxypropyltrimethoxysilane were put into a 2L internal mixer, and densely Refining for 1 hour, then adding 0.1g of platinum catalyst with a platinum content of 500ppm in a nitrogen atmosphere, and banburying for 10 minutes, finally adding 0.1g of methylpentynol, and continuing banburying for 10 minutes to obtain high refractive index silicone Material. Take out 100g of the mixture and vacuumize it and place it in the tablet-making mold and the adhesion test mold respectively, and test the mechanical tensile str...

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Abstract

The invention relates to a high-refractive-index organosilicon material for light-emitting diode (LED) packaging and a preparation method of the high-refractive-index organosilicon material. The technical scheme includes that according to a formula ration, three materials of a phenyl vinyl silicone resin, a phenyl hydrogen silicone resin and nano silicon dioxide (particle size distribution 5-15nm) which is treated by a silane coupling agent are placed in a 2L internal mixer to be internally mixed for one hour, then a platinum catalyst with a platinum content of 200-1000ppm is added to a nitrogen atmosphere, internal mixing is performed for 10 minutes again, finally, an alkynol compound is added, and internal mixing is continuously performed for 10 minutes to obtain the high-refractive-index organosilicon material. Compared with existing high-refractive-index organosilicon materials for LED packaging, the high-refractive-index organosilicon material for LED packaging is higher in drawing strength and larger in cohesive force under the condition of the same refractive index and light transmittance.

Description

technical field [0001] The invention relates to organic silicon materials, especially high refractive index organic silicon materials used for LED packaging. Background technique [0002] At present, most of the silicone materials used for LED packaging are materials with ordinary refractive index, and its refractive index is (1.41-1.43), but the LED luminous flux packaged with this ordinary refractive index silicone material has low luminous flux and waterproof effect. bad. In order to pursue a higher luminous flux, the LED packaging industry gradually adopts phenyl-modified silicone materials for LED packaging. This phenyl-modified silicone material has a high refractive index of (1.51-1.56). The light transmittance of packaged LEDs is generally increased by 5-10%, and the water resistance is also better than ordinary refractive index. However, the disadvantages of using phenyl-modified silicone materials in the prior art are: bonding with the substrate Poor strength, po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K9/06C08K3/36H01L33/56
Inventor 汤胜山侯海鹏邹小武
Owner 东莞市贝特利新材料有限公司
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