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Silicone resin glue for LED encapsulation and preparation method thereof

A technology of LED packaging and silicone resin glue, which is applied in chemical instruments and methods, fibrous fillers, electrical components, etc., can solve the problems of reducing the transparency of silicone resin and losing its use value, and achieves low cost, good compatibility, The effect of simple preparation process

Active Publication Date: 2016-01-13
JIANGSU BREE OPTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Studies have shown that nano-TiO 2 As a filler filled into the LED packaging silicone resin, it can effectively improve the refractive index of the silicone resin, but ordinary nano-TiO 2 It has a strong light scattering effect, which greatly reduces the transparency of silicone resin and loses its use value

Method used

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  • Silicone resin glue for LED encapsulation and preparation method thereof
  • Silicone resin glue for LED encapsulation and preparation method thereof
  • Silicone resin glue for LED encapsulation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Add 10g of nano-titanium dioxide with a particle size of 80nm into a 250mL four-necked flask filled with 100g of distilled water, and disperse ultrasonically for 20min; place the flask in a water bath and heat it to 70°C, equipped with a thermometer, N 2 Protective device and mechanical stirrer, add 0.1g potassium persulfate and 1g styrene in sequence, stir and react for 5h, filter with filter membrane, wash with ethanol for 3 times, dry in an oven at 90°C to obtain modified nano titanium dioxide;

[0026] Take 0.3g of modified nano-titanium dioxide, add it to a round bottom flask containing 99.7g of phenylvinyl silicone resin, ultrasonically disperse it, stir it mechanically (stirring speed 1000rad / min), and mix it evenly to obtain the silicone resin glue for LED packaging .

[0027] The refractive index of the silicone resin glue for LED encapsulation obtained in this embodiment is 1.56, and the transmittance at the 450nm wavelength place of its 1mm thick standard sam...

Embodiment 2

[0029] Add 10g of nano-titanium dioxide with a particle size of 95nm into a 250mL four-necked flask filled with 200g of distilled water, and disperse ultrasonically for 20min; place the flask in a water bath and heat it to 70°C, equipped with a thermometer, N 2 Protective device and mechanical stirrer, add 0.1g potassium persulfate and 1.5g styrene in sequence, stir and react for 5 hours, filter with membrane, wash with ethanol for 3 times, dry in an oven at 90°C to obtain modified nano-titanium dioxide;

[0030] Take 2.0g of modified nano-titanium dioxide, add it to a round-bottomed flask containing 98g of epoxy-modified silicone resin, ultrasonically disperse it, stir it mechanically (stirring speed 1200rad / min), and mix it evenly to obtain the silicone resin glue for LED packaging .

[0031] The refractive index of the silicone resin glue for LED encapsulation obtained in this embodiment is 1.60, and the transmittance at the 450nm wavelength place of its 1mm thick standard ...

Embodiment 3

[0033] Add 15g of nano-titanium dioxide with a particle size of 80nm into a 250mL four-necked flask filled with 150g of distilled water, and disperse ultrasonically for 20min; place the flask in a water bath and heat it to 70°C, equipped with a thermometer, N 2 Protective device and mechanical stirrer, add 0.2g potassium persulfate and 2g styrene in sequence, stir and react for 5h, filter with membrane, wash with ethanol for 3 times, dry in an oven at 90°C to obtain modified nano-titanium dioxide;

[0034] Take 3.0g of modified nano-titanium dioxide, add it into a round-bottomed flask containing 97g of phenylvinyl silicone resin, ultrasonically disperse, stir mechanically (stirring speed 1500rad / min), and mix evenly to obtain the silicone resin glue for LED packaging.

[0035] The refractive index of the silicone resin glue for LED encapsulation obtained in this embodiment is 1.62, and the transmittance at the 450nm wavelength place of its 1mm thick standard sample is 72.3%, sp...

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Abstract

The invention relates to a silicone resin glue for LED packaging. The silicone resin glue includes silicone resin and modified nano-titanium dioxide, and the weight ratio of modified nano-titanium dioxide to silicone resin is (0.1~3):(97~99.9); The modified nano-titanium dioxide is nano-titanium dioxide surface-treated with potassium persulfate and styrene. The invention also relates to a preparation method of the silicone resin glue for LED packaging. The invention significantly improves the refractive index of the silicone resin glue by adding the modified nano-titanium dioxide treated with potassium persulfate and styrene surface; the modified nano-titanium dioxide has excellent compatibility with the high-refractive index silicone resin glue, making the silicone resin The glue maintains a high degree of transparency. The preparation process of the invention is simple, the cost is low, and it is beneficial to realize industrialized production.

Description

technical field [0001] The invention relates to a silicone resin glue for LED packaging, in particular to a silicone resin glue for high refractive index LED packaging and a preparation method thereof, in particular to an LED that can significantly increase the refractive index while maintaining high transparency Silicone resin glue for encapsulation and its preparation method. Background technique [0002] At present, the LED market is developing rapidly. Due to the continuous improvement of its power and brightness, more stringent requirements are put forward for packaging materials. The existing packaging materials are far from meeting the requirements in terms of aging resistance and stability. Therefore, major researches at home and abroad The organization is actively working on the development of new LED packaging organic silicon materials. Traditional LED packaging materials use epoxy resin, polyurethane and other materials. However, epoxy resin has poor weather resi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/04C08K9/04C08K9/02C08K3/22C09C1/36C09C3/06C09C3/08H01L33/56
Inventor 何锦华李树亚梁超
Owner JIANGSU BREE OPTRONICS CO LTD