Miniaturized integrated micro electo-mechanical systems (MEMS) optical sensor array

A micro-electromechanical sensor and sensing technology, applied in scientific instruments, instruments, microstructure technology, etc., can solve the problems of not being available on site, lack of parallel detection capability, expensive infrastructure, etc.

Inactive Publication Date: 2013-12-04
KOC UNIVSI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Such systems that meet the needs of parallel, label-free, and highly selective sensing are thought to not exist today because microsystems technology and readout methods are not able to meet expectations for a variety of reasons including: Associated with functional surfaces robustness issues and lack of a truly integrated, array-compatible readout technology
Alternatively, microarray technologies are believed to be able to provide parallel and selective detection but are not available in the field as they require specialized skills to run and maintain and require expensive infrastructure due to complex labeling and sensing methods
While many field applications such as pregnancy test kits or glucose sensors exist, these are limited to one species and lack parallel detection capabilities

Method used

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  • Miniaturized integrated micro electo-mechanical systems (MEMS) optical sensor array
  • Miniaturized integrated micro electo-mechanical systems (MEMS) optical sensor array
  • Miniaturized integrated micro electo-mechanical systems (MEMS) optical sensor array

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Embodiment Construction

[0032] The key areas of the system in a preferred embodiment can be listed as follows: (1) Preferably includes the use of die-bonded laser diode arrays (1D VCSEL arrays), photodetectors, and CMOS using wafer thinning and through-Si via technology Detector chip with novel integrated optoelectronic chip on silicon for readout electronics; (2) MEMS sensor array 110 with micro / nano resonant cantilever with integrated grating structure, heating element, and remote electromagnetic actuator for disposable chip (also known as MEMS chips); (3) 3D integration of integrated optoelectronic chips and MEMS chips in the case of hybrid stacks; (4) MEMS cantilevers using a focus-fixed approach that addresses only one individual cantilever from the array Functionalization of recognition molecules (proteins, oligonucleotides, chemical assemblies) with different specificities; (5) Parallel sensor array operation (from 2 up to 64 parallel channels) for highly selective and accurate recognition of c...

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Abstract

This invention describes a method and apparatus for actuation and multiplexed sensing using an array of sensing elements. The invention can be used for label- free detection of biological and chemical agents in a robust, miniaturized package. The invention integrates photonics, CMOS electronics, and Micro / Nano system technologies and allows multi-analyte sensing in the same package. The preferred actuation method is using magnetic thin films and preferred sensing method is optical using interference means.

Description

[0001] This application claims the benefit of U.S. Provisional Patent Applications Serial No. 61 / 409,111, filed November 1, 2010, and Serial No. 61 / 430,871, filed January 7, 2011, both of which are fully incorporated herein by reference in their entirety middle. technical field [0002] The present invention relates to a microelectromechanical system (also referred to as "MEMS") Miniaturized Integrated MEMS Optical Sensor Array (MIMOSA), and more preferably to sensor arrays using moving mechanical surfaces, and most preferably to label-free biosensing. Background technique [0003] In the sensing area, vibrating mechanical structures such as microcantilever arrays find various applications based on advantages such as lower detection limits due to miniaturization, the ability to optimize the shape of the cantilever, selectively placing functionalized regions The capability on these cantilevers (also referred to interchangeably as "microcantilevers"), and the possibility to w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N29/02G01N29/24
CPCG01N29/022G01N2291/014G01N2291/0427G01N29/2418G01N2291/02466B81B7/02G01N29/02G01N33/54373
Inventor H.尤里B.E.阿拉卡E.蒂穆多甘
Owner KOC UNIVSI
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