Method for manufacturing shell of microwave high-power pipe

A manufacturing method and high-power technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the inability to fully develop and produce high-power-density microwave high-power tube shells, and achieve the effect of reducing cost advantages

Inactive Publication Date: 2013-12-11
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to various reasons such as the protection of business secrets among competitors, price factors, and differences in the technical level of material suppliers, the "Cu-Laminate" hea

Method used

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  • Method for manufacturing shell of microwave high-power pipe
  • Method for manufacturing shell of microwave high-power pipe
  • Method for manufacturing shell of microwave high-power pipe

Examples

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Embodiment

[0032] First follow Pic 4-1 , Figure 4-2 and Figure 4-3 The structure and dimensions of the product shown, purchase the following metal parts: Kovar sealing ring P with a size of 0.1mm×21.5mm×8.5mm 1 , Kovar lead wire P with a size of 0.1mm×5.1mm×12.7mm 2 ;The size is 1.52mm×34.0mm×9.8mm tungsten copper WCu15 piece P 5 ;Oxygen-free copper foil P with a size of 0.5mm×34.0mm×9.8mm in thickness 6 . The above-mentioned metal parts are used after conventional cleaning, annealing and nickel-plating treatment.

[0033]Second, follow the image 3 The shown conventional HTCC multi-layer ceramic process produces a 95% alumina ceramic frame P with a size of 1.2mm×21.7mm×9.8mm and a wall thickness of 2.0mm 3 . For 95% alumina ceramic frame P 3 Ready to use after nickel plating.

[0034] Then, the part Kovar seal ring P 1 ; Kovar lead P 2 ; Alumina ceramic frame P 3 ; Tungsten Copper WCu15 P 5 ; Oxygen-free copper foil P 6 according to Pic 4-1 , Figure 4-2 and Figur...

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Abstract

The invention provides a method for manufacturing a shell of a microwave high-power pipe. Existing commercialized tungsten copper or molybdenum copper or other copper-based composite materials cover the two sides of copper foil, and 'Cu-Laminate' heat sink of the copper-based composite materials of a sandwich structure is synchronously formed in the braze welding process of a semi-finished product of the shell. The method has the advantages that the braze-welded shell is in a stress state with the safe strength, and heat conductivity is at least increased by 10% compared with heat conductivity of a shell that only core layer alloy is used. Heat dissipation capacity, air tightness and long-term reliability of the shell manufactured according to the process route and the method can meet the packaging requirements of a high-power-density microwave high-power device. Due to the fact that core layer materials used for forming 'Cu-Laminate' heat sink are mature commercialized tungsten copper and molybdenum copper, the cost advantage is possessed, and material procurement risks can be greatly reduced.

Description

technical field [0001] The invention relates to a manufacturing method of a microwave high-power tube casing, which is aimed at a high-power-density microwave casing for packaging silicon LDMOS power tubes or GaN power tubes, and belongs to the technical field of microwave high-power tubes. Background technique [0002] The microwave high-power tube casing used to package silicon LDMOS power tubes or GaN power tubes usually uses a metal heat sink welded ceramic frame structure, and the airtight cavity formed by the two provides mechanical support and environmental protection for the chip and internal circuits. Metal leads are welded on the ceramic frame to realize input and output feed ports and mutual isolation. The heat sink is made of copper-based composite material with high thermal conductivity and thermal expansion coefficient matched with ceramics, which becomes the main heat dissipation channel of the device and ensures that the shell is in a safe and reliable low-st...

Claims

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Application Information

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IPC IPC(8): H01L21/48
Inventor 杨建胡进陈宇宁程凯王子良
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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