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Heterogeneous bonding and forming device

A heterogeneous and hoisting technology, applied in the direction of microstructure devices, processing microstructure devices, precision positioning equipment, etc., can solve the problems of large errors, low degree of automation, poor repeatability of manual operations, etc., and achieve stable and high glue output. The effect of precision and stable work

Active Publication Date: 2013-12-25
铜陵太阳岛农业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most important thing is that most of the existing bonding methods are not highly automated, and it is impossible to rely solely on human operations. It is difficult to ensure the precise positioning of the two materials, and manual operations have poor repeatability and large errors, and chip preparation cannot be mass-produced.

Method used

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Embodiment Construction

[0027] Below in conjunction with embodiment the present invention is described in further detail:

[0028] Heterobond forming devices such as figure 1 As shown, it includes workbench A, hoisting mechanism F, plate loading mechanism B, glue dispensing mechanism C, bonding mechanism D, and sheet loading mechanism E. The device is used to complete the bonding process of materials M and N of two different materials. The material M is made of PMMA with a size of 400mmX400mmX2mm. The material N is made of glass, and its size is 24mmX60mmX0.17mm. There are 40 through holes evenly distributed on the material M for placing the material N. The through holes are set in a stepped shape. The large end of the stepped hole is used to hold the material N, and the small end is used for other process requirements.

[0029] The workbench as figure 2 As shown, it is a rectangular cabinet 1 structure with steps, which is used as a load-bearing and accommodation facility for all precision mech...

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Abstract

The invention discloses a heterogeneous bonding and forming device. The heterogeneous bonding and forming device comprises a worktable, wherein a lifting mechanism for lifting materials is fixedly arranged on the worktable, and a plate loading mechanism, a dispensing mechanism, a sheet loading mechanism and a bonding mechanism are arranged below the lifting mechanism; the plate loading mechanism comprises a material plate which is driven to move up and down by a motor and is used for placing a material M; the dispensing mechanism comprises a limiting trough longitudinally moving along the worktable to limit the material M, and a dispensing needle head transversely and vertically moving along the worktable is arranged above the limiting trough; the bonding mechanism comprises a positioning disc, a lead-in trough closed towards the bottom is arranged on at least one side of the positioning disc, and an inclined angle of the lead-in trough is 55-65 degrees; the sheet loading mechanism comprises a second material plate for placing a material N, and a push plate capable of moving up and down is arranged below the second material plate; the lifting mechanism comprises a vacuum chuck transversely and vertically moving along the worktable. By utilizing the lifting mechanism and an auxiliary positioning device, the difficulties of high-precision positioning, repeated positioning and high-precision controllability in a heterogeneous bonding process are greatly solved.

Description

technical field [0001] The invention relates to a mechanical device for manufacturing products in the micro-electromechanical field, in particular to a mechanical device for manufacturing microfluidic chips with a high degree of automation. Background technique [0002] An integrated microfluidic chip can be prepared by using microfluidic chip technology and high-throughput gene chip technology. Through highly integrated and automated technology, the assay work of the entire laboratory can be completed on this chip. Using a microfluidic chip can detect 500 kinds of non-cultured microorganisms at one time. Compared with traditional culture technology, it has the characteristics of large detection throughput, fast detection speed, high degree of automation, and easy operation. Good tool for research. [0003] The measurement unit for the preparation of microfluidic chips is calculated in microns, and the manufacturing precision is required to be high. And it usually involve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
Inventor 白向阳
Owner 铜陵太阳岛农业科技有限公司
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