COMS (complementary metal-oxide semiconductor) image sensor and manufacturing method thereof

A technology of an image sensor and a manufacturing method, which is applied in the field of semiconductors, can solve the problems of white spots in a COMS image sensor, damage to the surface of a semiconductor substrate, etc., and achieves the effects of simple method, easy operation, and avoidance of white spots.

Inactive Publication Date: 2013-12-25
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The invention provides a COMS image sensor and a manufacturing method thereof to solve the problem of white spots in the COMS image sensor caused by damage to the surface of the semiconductor substrate in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • COMS (complementary metal-oxide semiconductor) image sensor and manufacturing method thereof
  • COMS (complementary metal-oxide semiconductor) image sensor and manufacturing method thereof
  • COMS (complementary metal-oxide semiconductor) image sensor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] It can be seen from the background art that the CMOS image sensor formed in the prior art causes damage to the surface of the semiconductor substrate due to ion implantation, resulting in white spots. The inventors conducted research on the above problems and found that after the dielectric layer was removed by sidewall etching, the remaining dielectric layer was relatively thin, and the subsequent ion implantation of the doped layer on the surface of the photodiode would cause damage to the semiconductor substrate on the surface of the photodiode, while White spots are very sensitive to the surface quality and integrity of photodiodes, and damage to the semiconductor substrate can cause white spots to appear in CMOS image sensors.

[0039] After further research, the inventor proposed a CMOS image sensor and a manufacturing method thereof.

[0040] The CMOS image sensor proposed by the present invention and its manufacturing method will be further described in detail b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a COMS (complementary metal-oxide semiconductor) image sensor and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a first doped area on the surface of a semiconductor substrate; sequentially forming a gate oxidation layer and gate polycrystalline silicon; forming a second doped area in the semiconductor substrate; depositing a dielectric layer and forming a side wall through an exposure and etching process; forming a third doped area on the surface of the semiconductor substrate; removing the dielectric layer on the surface of the semiconductor substrate; and forming a fourth doped area in the first doped area. According to the manufacturing method provided by the invention, the gate side wall is formed by etching, ion injection is performed after removal of a photoresist to form the third doped area on the surface of the semiconductor substrate, and then the dielectric layer on the surface of the semiconductor substrate is removed to prevent secondary ion injection from damaging the semiconductor substrate on the surface of a light-sensitive diode, so that white points of the CMOS image sensor caused by damage of a semiconductor are avoided, and the quality of the CMOS image sensor is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a CMOS image sensor and a manufacturing method thereof. Background technique [0002] Image sensors are an important part of digital cameras. According to the different components, it can be divided into two categories: CCD (Charge Coupled Device, charge-coupled device) and CMOS (Complementary Metal-Oxide Semiconductor, metal oxide semiconductor device). With the continuous development of the manufacturing process of CMOS integrated circuits, especially the design and manufacturing process of CMOS image sensors, CMOS image sensors have gradually replaced CCD image sensors and become the mainstream. Compared with CMOS image sensors, it has the advantages of higher industrial integration and lower power. [0003] In a CMOS image sensor, a transfer transistor (TX) is used to transfer photogenerated electrons in a photodiode. [0004] figure 1 A schematic structural diagra...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
Inventor 孙玉红张克云饶金华令海阳
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products