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led radiator

An LED radiator and LED chip technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problem of increasing the weight of the radiator, and achieve the effect of reducing the weight, increasing the convective heat exchange area, and enhancing the disturbance of the air.

Active Publication Date: 2016-08-24
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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  • Abstract
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Problems solved by technology

However, since the density of copper is greater than that of aluminum alloy, the weight of the entire radiator increases

Method used

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values ​​may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values ​​within acceptable error margins or design constraints. The directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the...

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Abstract

The invention provides an LED radiator. The LED heat sink includes: a sunflower-shaped heat sink 100, including a cylindrical body 110 and a plurality of cooling fins 120 extending outward from the cylindrical body; In the cylindrical body of the heat sink, it is cylindrical, and its outer cylindrical surface is in close contact with the inner cylindrical surface of the sunflower-shaped heat sink cylindrical body. The LED chip 300 is attached to the graphite heating core. The upper surface or the lower surface is used to transfer the LED chips 300 to the sunflower-shaped heat sink 100 . Because the heat-taking core made of graphite is adopted, the heat dissipation efficiency of the LED radiator of the present invention is greatly improved, and the weight is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to an LED radiator. Background technique [0002] About 80% of the electric energy of the LED chip is converted into heat during the working process. If effective measures cannot be taken to release the heat into the environment, the junction temperature of the chip will increase, the luminous efficiency will decrease, and the lifespan will be shortened. Therefore, chip heat dissipation is a key issue that must be solved for high-power LED packaging. At present, the heat dissipation of LED chips mainly adopts the following cooling methods: [0003] 1. Air cooling: At present, the heat dissipation of LED chips mainly adopts air natural convection cooling and forced air cooling. These two heat dissipation methods have the advantages of simple structure and low cost. For small power bulb lamps and low heat flux density The dot-matrix LED lights, the air-cooled heat dissipati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64
Inventor 王涛胡学功郭朝红于东郭聪唐大伟
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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