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Preparation method and application of organic silicon resin adhesive

A resin type and adhesive technology, applied in adhesives, etc., can solve the problems of poor product storage stability, and achieve the effects of improving storage stability, high temperature resistance, insulation smoke generation, and good bonding performance

Active Publication Date: 2014-01-29
HANGZHOU NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of poor storage stability of the product as the R / Si is lower for the silicone resin adhesive, the present invention provides a method for preparing the silicone resin adhesive. In the prepared silicone resin adhesive, R / Si<1, while improving product storage stability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Add 180g methyltriethoxysilane, 105g tetraethyl orthosilicate, 15g dimethyldiethoxysilane and 250g toluene into a 1000mL four-neck flask, heat up to 50°C, add 0.3g activated clay, The number is 20, the temperature is controlled at 50°C, and 56.8g of deionized water (the molar ratio of deionized water to ethoxy group is 0.6:1) is started to be added dropwise, and the dropwise addition time is 1 hour. React for 4 hours, remove the catalyst by filtration, evaporate the liquid, and finally raise the temperature to 110°C, react for 5 minutes, and quickly add the solvent. The weight ratio of the solvent component is toluene:isopropanol:n-butanol:polyethylene glycol 600= 75:10:10:5, and then use it to make a silicone resin adhesive 1 with a solid content of 50%.

Embodiment 2

[0020] Add 160g methyltriethoxysilane, 80g tetraethylorthosilicate, 40g dimethyldiethoxysilane and 250g toluene into a 1000mL four-neck flask, heat up to 60°C, add 0.1g activated clay, The mesh number is 30, the temperature is controlled at 60°C, and 64.8g of deionized water (the molar ratio of deionized water to ethoxy group is 0.85:1) is started to be added dropwise, and the dropping time is 2 hours, and the temperature is maintained after dropping React at low temperature for 2 hours, remove the catalyst by filtration, evaporate the liquid, and finally raise the temperature to 115°C, react for 10 minutes, and quickly add the solvent. The weight ratio of the solvent component is toluene:isopropanol:n-butanol:polyethylene glycol 600 =85:5:5:5, and then adjust it into a silicone resin adhesive 2 with a solid content of 55%.

Embodiment 3

[0022] Add 160g methyltriethoxysilane, 90g tetraethylorthosilicate, 20g dimethyldiethoxysilane and 250g toluene into a 1000mL four-neck flask, heat up to 65°C, add 0.5g activated clay, The mesh number is 50, the temperature is controlled at 65°C, and 68g of deionized water (the molar ratio of deionized water to ethoxy group is 0.8:1) is started to be added dropwise, and the dropwise addition time is 1.5 hours. React for 3 hours, remove the catalyst by filtration, evaporate the liquid, and finally raise the temperature to 105°C, react for 6 minutes, and quickly add the solvent. The weight ratio of the solvent component is toluene:isopropanol:n-butanol:polyethylene glycol 600= 82:8:9:1, then use it to make a silicone resin adhesive 3 with a solid content of 30%.

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Abstract

The invention relates to organic chemical synthesis. In order to solve the problem of lower storage stability of the product when the R / Si ratio of the organic silicon resin adhesive is lower, the invention provides a preparation method of an organic silicon resin adhesive, which comprises the following steps: adding tetraethyl orthosilicate, methyltriethoxysilane, dimethyldiethoxysilane and toluene into a reaction kettle, heating to 50-70 DEG C, adding a catalyst, dropwisely adding deionized water at 50-70 DEG C within 1-2 hours to perform hydrolysis, reacting for 2-4 hours, filtering out the catalyst, drying the liquid by distillation, heating the system to 105-115 DEG C to react for 5-10 minutes, adding a solvent for dissolution, cooling to room temperature, and blending with the solvent to obtain the organic silicon resin adhesive of which the solid content is 30-55%. The R / Si ratio in the organic silicon resin adhesive is smaller than 1; the storage stability of the product is enhanced; and the organic silicon resin adhesive is applicable to mica binding.

Description

technical field [0001] The invention relates to the field of organic chemical synthesis, in particular to a method for preparing a silicone resin adhesive and its application in mica bonding. Background technique [0002] Silicone resin adhesives have excellent heat resistance, electrical insulation, chemical resistance, water repellency and flame retardancy, and are used as adhesives for high-temperature resistant mica boards. Adhesives for mica boards determine the high-temperature resistance and thermal decomposition properties. High temperature resistant mica board is widely used in the electric heating appliance industry, but with the development of electrical manufacturing technology, the requirements for environmental protection and food hygiene continue to increase, and the requirements for mica board are also increasing. It not only has the characteristics of high temperature resistance and less smoke characteristics, and must have a certain mechanical strength. A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C08G77/06
Inventor 吴连斌陈利民陈遒郑战江裴勇兵汤龙程杨雄发华西林蒋剑雄来国桥
Owner HANGZHOU NORMAL UNIVERSITY
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