High-speed image recognition positioning information processor and processing method

Abstract

The invention discloses a high-speed image recognition positioning information processor which comprises a CCD lens, an A/D converter, an FPGA, an FPGA extended SDRAM, an FPGA extended Flash, a DSP, a DSP extended SDRAM and a DSP extended Flash, wherein the CCD lens is used for obtaining an image analog signal of an object to be detected; the A/D converter is used for transforming the received image analog signal to a digital signal; the FPGA is used for collecting image data and preprocessing an image; the DSP is used for identifying and locating the image. A processing method comprises the steps of firstly, calibrating an imaging system in the DSP before identifying and locating are performed, secondly, calculating a transformational matrix H, thirdly, completing matching between the image and a standard image, fourthly, completing morphological image processing and finally completing Blob analysis, labeling connected domains, calculating the area of defects and the perimeter of the defects and completing the spatial physical location prediction of the defects. According to the high-speed image recognition positioning information processor and the processing method, the defects in an integrated circuit can be fast identified and located in a high-accuracy mode.

Description

technical field [0001] The invention relates to the field of defect identification and positioning in the precision electronic packaging process, in particular to a high-speed image identification and positioning information processor and processing method. Background technique [0002] The development of integrated circuit (IC) microfabrication technology, silicon material technology, silicon structure design technology and mass production technology has made integrated circuits from small scale (SSI), medium scale (MSI), large scale (LSI) and Very Scale (VLSI) has entered Very Scale (VLSI), and gradually develops into the era of Giant Scale (GSI) and System-on-Chip (SOC). IC design, manufacturing and packaging testing are the three pillars of IC industry development. IC packaging not only directly affects the electrical performance, mechanical performance, optical performance and thermal performance of the IC itself, but also affects its reliability and cost, and also det...

AI Technical Summary

Problems solved by technology

[0005] Since the image capture device plays an indispensable role in the identification and positioning of defects, in order to meet the high precision, the requirements for visual technology are also increasing, and the complexity is increasing, which leads to the processing of data in the image processing and identification process. The amount is large, takes up a lot of time, reduces the real-time performance of the system, and greatly affects the application of machine vision technology

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