This invention relates to the field of
image processing technology, specifically to a method for detecting through-hole chucks that integrates
mask positioning and AI re-inspection. The method involves preprocessing and contour detection of the original workpiece image to achieve coarse positioning of the through-hole region; constructing a multi-layer
mask based on the precise geometric information of the through-hole; extracting candidate defect regions through
mask subtraction and bitwise AND operations; performing
Blob analysis on the candidate defect regions; and conducting multi-dimensional feature analysis and screening based on the physical prior conditions of the chuck to obtain traditional detection judgment results; inputting the through-hole region image into a
deep learning model for re-inspection to obtain
deep learning detection results; and performing a joint judgment based on the traditional detection judgment results and the
deep learning detection results to output the final defect judgment result. This invention achieves precise positioning of the through-hole through multi-layer mask operation and, combined with the joint decision-making of
Blob analysis and AI re-inspection, significantly improves the accuracy and robustness of through-hole chuck defect detection while reducing the
false detection rate.