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Grinding tool with ceramic bonding agents and method for manufacturing grinding tool

A vitrified bond and abrasive tool technology, applied in the direction of abrasive materials, grinding devices, manufacturing tools, etc., can solve problems affecting the working performance of abrasive tools, achieve equivalent grinding performance, lower manufacturing costs, and beautiful appearance

Inactive Publication Date: 2014-02-12
SAINT GOBAIN RES SHANGHAI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] The present invention provides a novel vitrified bond abrasive tool for mold processing in the microelectronics industry and its production method, thereby solving the defects and problems existing in the prior art, and also overcoming the long-standing problems of those skilled in the art A technical prejudice that corundum abrasives in vitrified bonded abrasives cannot be partially replaced by materials with lower hardness, otherwise the working performance of the abrasives will be affected

Method used

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  • Grinding tool with ceramic bonding agents and method for manufacturing grinding tool
  • Grinding tool with ceramic bonding agents and method for manufacturing grinding tool
  • Grinding tool with ceramic bonding agents and method for manufacturing grinding tool

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0125] Example 1: Preparation of Vitrified Bond Abrasives Using 23% by Volume of Kyanite

[0126] According to following formula, vitrified bond abrasive tool is prepared according to the method of the present invention:

[0127] 48% by volume of abrasive, wherein the abrasive consists of 23% by volume of kyanite (35 mesh (mesh), purchased from Virginia Kyanite Mining Corporation (Virginia Kyanite Mining Corporation)) and 77% by volume of white corundum ( Purchased from Jining Yunhe Emery Factory, 46#) composition, based on the volume of the abrasive;

[0128] 10% by volume of vitrified bonding agent (that is, vitrified bonding material prepared by the applicant);

[0129] 2% by mass of chrome-green material (purchased from Zibo Fluor New Materials Co., Ltd.), based on the mass of the vitrified bond.

[0130] The “deepness of grinding (MDBB)” of the prepared vitrified bonded abrasive tools was tested according to conventional methods in the field, and the results are shown...

Embodiment 2

[0131] Example 2: Preparation of Vitrified Bond Abrasives Using 30% by Volume of Kyanite

[0132] A vitrified bond abrasive tool was prepared according to the method of the present invention according to the same formula as that shown in Example 1, except that the abrasive material composed of 30 volume percent kyanite and 70 volume percent corundum was used.

[0133] The “deepness of grinding (MDBB)” of the prepared vitrified bonded abrasive tools was tested according to conventional methods in the field, and the results are shown in Table 1 below.

[0134] The appearance of the prepared vitrified bonded abrasive tools is as follows figure 2 shown. from figure 2 It can be seen from the figure that a uniform color is formed on the surface of the prepared grinding wheel without obvious dark spots, so that the appearance of the grinding wheel is beautiful.

Embodiment 3

[0135] Embodiment 3: use 30 volume % of kyanite to prepare vitrified bond abrasive tool

[0136] Except using 3% by mass of chrome-green material, according to the same formula as that shown in Example 2, a vitrified bonded abrasive tool was prepared according to the method of the present invention.

[0137] The “deepness of grinding (MDBB)” of the prepared vitrified bonded abrasive tools was tested according to conventional methods in the field, and the results are shown in Table 1 below.

[0138] The appearance of the prepared vitrified bonded abrasive tools is as follows image 3 shown. from image 3 It can be seen from the figure that a uniform color is formed on the surface of the prepared grinding wheel without obvious dark spots, so that the appearance of the grinding wheel is beautiful.

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Abstract

The invention relates a grinding tool with ceramic bonding agents and a method for manufacturing the grinding tool, and provides a grinding tool with ceramic bonding agents for processing microelectronics molds and dies. The grinding tool and the method are used for processing microelectronics molds and dies. The grinding tool comprises corundum grinding compounds, kyanite and the ceramic bonding agents. The volume of the kyanite accounts for 9% to 45% of the total volume of the corundum grinding compounds and the kyanite.

Description

technical field [0001] The invention belongs to the field of abrasive tools, and relates to a vitrified bonded abrasive tool, more specifically, to a vitrified bonded abrasive tool used for mold processing in the microelectronics industry and a production method thereof. Background technique [0002] Microelectronics technology is the core technology of high-tech and information industry, and it is a new technology developed along with integrated circuits, especially ultra-large-scale integrated circuits. It includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly, and is the sum of various process technologies in microelectronics. The microelectronics industry is also a basic industry. The reason why it develops so fast is not only the huge contribution of technology itself to the national economy, but also its strong permeability. Semiconductors such as ...

Claims

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Application Information

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IPC IPC(8): B24D3/14B24D18/00
Inventor 张大明
Owner SAINT GOBAIN RES SHANGHAI