UV adhesive curing method and OLED packing method

Abstract

The invention provides a UV adhesive curing method and an OLED packing method. The UV adhesive curing method comprises the step 1 of providing a UV light source (60) and opening the UV light source (60) to irradiate UV adhesive (24) for the first time, the step 2 of closing the UV light source (60) and opening the UV light source (60) to irradiate the UV adhesive (24) for the second time every 10-300 seconds and the step 3 of repeating the step 2 until the UV adhesive (24) is completely cured. The UV adhesive curing method uses an interval irradiation mode to effectively reduce the temperature of a glass substrate, further effectively avoids the phenomenon that an organic function layer is degraded due to higher temperature, prolongs the service life of OLED equipment and improves the quality of the OLEN equipment.

Description

technical field [0001] The invention relates to a UV glue curing method, in particular to a UV glue curing method and an OLED packaging method. Background technique [0002] Organic light emitting diode or organic light emitting display (Organic Light Emitting Diode Display, OLED), also known as organic electroluminescent diode, is a new display technology developed since the middle of the 20th century. Compared with liquid crystal displays, organic electroluminescent diodes have many advantages such as full solid state, active light emission, high brightness, high contrast ratio, ultra-thin, low cost, low power consumption, fast response, wide viewing angle, wide operating temperature range, and easy flexible display. advantage. [0003] see figure 1 , the structure of an organic electroluminescent diode generally includes: a substrate 100 , a light-emitting element 300 formed on the substrate 100 , and a package cover 500 attached to the substrate 100 , wherein the light...

AI Technical Summary

Problems solved by technology

However, during the process of curing UV glue by UV lamps, the temperature of the glass substrate will also rise accordingly. Excessively high temperatures (when exceeding the Tg point of organic materials) will cause denaturation of organic materials in organic electroluminescent diodes, thereby affecting organic electroluminescence. The performance of diode products, so it is better to hope that the temperature on the glass substrate is lower during UV curing

[0006] However, in the actual UV curing process, when the penetration rate of the UV band is superimposed on the glass substrate, UV filter, or even the flexible substrate (PEN film) for flexible display, in order to achieve the cumulative amount required for UV glue curing The amount of light may require UV irradiation for a long time. At this time, the temperature of the glass substrate will rise significantly, which may affect the OLED organic material.

[0007] For example, see figure 2 , which is the temperature curve of the glass substrate when the OLED is encapsulated by the existing direct irradiation method. In this figure, the illuminance of the UV light source is: 100mw / cm 2 , the maximum temperature of the glass substrate after 180 seconds of direct irradiation with a UV light source is 90°C, which may lead to deterioration of OLED organic materials, thereby affecting the quality of OLED

Images