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Cleaning solution and cleaning method for removing palladium solution on pcb board

A technology of PCB board and cleaning solution, which is applied in the field of PCB board production, can solve problems such as difficult cleaning of palladium removal solution, unclean copper surface after tin stripping, and red lines, so as to shorten scanning and detection time and reduce the number of false points , Guarantee the effect of board surface quality

Active Publication Date: 2015-09-02
AOSHIKANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the remaining palladium removal solution on the board is not easy to clean, so that when the tin is stripped, the circuit becomes red and the board surface is foggy, similar to the phenomenon of unclean tin stripping or copper surface corrosion, which affects the appearance quality. During inspection, it is easy to cause Misjudgment, affecting production efficiency

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0013] A cleaning solution for removing palladium solution on a PCB, by volume, the cleaning solution includes 22% to 28% of sulfuric acid with a concentration of 98%, 45% to 55% of hydrogen peroxide with a concentration of 50%, and the remainder is water, wherein The sum of the above components is 100%.

[0014] A cleaning method for removing palladium solution on a PCB, which is to clean the PCB board after being etched and sprayed with a solution for removing palladium in a cleaning tank with a cleaning solution. In volume terms, the cleaning solution includes a concentration of 98 The sulfuric acid of ﹪ is 22﹪~28﹪, the concentration of hydrogen peroxide is 45﹪~55﹪ of 50﹪, and the rest is water. , The cleaning time is 30 seconds to 60 seconds.

[0015] The cleaning solution described in this embodiment is by volume, a concentration of 98% of sulfuric acid 25%, a concentration of 50% of hydrogen peroxide 50%, and the rest is water, wherein the sum of each component is 100%....

Embodiment 2

[0021] In order to reduce the corrosion of the cleaning solution on the copper surface of the PCB, the cleaning solution of the present invention also includes a copper protecting agent, and the amount of the copper protecting agent added is 5.0g / L-8.0g / L. The copper protecting agent is benzotriazole.

[0022] When cleaning in the present invention, a copper protecting agent is added to the cleaning solution, and the amount added in this embodiment is 7.0 g / L.

[0023] The rest are the same as embodiment 1.

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PUM

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Abstract

The invention discloses a cleaning liquid for removing a palladium-removal liquid on a PCB plate and a cleaning method using the same. The cleaning liquid is characterized in that the cleaning liquid comprises, by volume, 22-28% of sulfuric acid having a concentration of 98%, 5-55% of hydrogen peroxide having a concentration of 50% and the balance water. In use, a PCB plate subjected to etching and palladium-removal liquid spray cleaning is cleaned by the cleaning liquid having a temperature of 25-35 DEG C in a cleaning tank for 30-60s. The cleaning liquid has simple components, can be prepared simply, can effectively remove the palladium-removal liquid residues on the PCB plate, can guarantee surface quality of the PCB plate subjected to tin stripping, can reduce false point quantity in automatic optical detection, and can shorten scanning and detection time.

Description

technical field [0001] The invention relates to the production of a PCB board, in particular to a cleaning solution for removing palladium solution on a PCB board and a cleaning method. Background technique [0002] With the development of the circuit board industry in the direction of high density and high precision, the surface treatment method of PCB boards has changed from the original method of spraying tin to the method of immersion gold. When the PCB board is sinking copper, palladium ions are adsorbed on the non-sinking copper holes, which leads to gold in the non-sinking copper holes when sinking gold. Therefore, after etching, the PCB board must be cleaned with a palladium removal solution to remove palladium ions. However, the remaining palladium removal solution on the board is not easy to clean, so that when the tin is stripped, the circuit becomes red and the board surface is foggy, similar to the phenomenon of unclean tin stripping or copper surface corrosion,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23G1/10C23G1/04C23F1/00
Inventor 程涌贺波胡海鸥
Owner AOSHIKANG TECH CO LTD
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